Intel Xeon E5-1620 v2 vs AMD Opteron 3320 EE
Comparative analysis of Intel Xeon E5-1620 v2 and AMD Opteron 3320 EE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-1620 v2
- 4 more threads: 8 vs 4
- Around 56% higher clock speed: 3.90 GHz vs 2.5 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 25% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2.6x better performance in PassMark - Single thread mark: 2022 vs 774
- 2.4x better performance in PassMark - CPU mark: 6549 vs 2675
Specifications (specs) | |
Number of threads | 8 vs 4 |
Maximum frequency | 3.90 GHz vs 2.5 GHz |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 64 KB (per core) vs 192 KB |
L3 cache | 10240 KB (shared) vs 8 MB |
Benchmarks | |
PassMark - Single thread mark | 2022 vs 774 |
PassMark - CPU mark | 6549 vs 2675 |
Reasons to consider the AMD Opteron 3320 EE
- CPU is newer: launch date 11 year(s) 2 month(s) later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 5.2x lower typical power consumption: 25 Watt vs 130 Watt
Launch date | 2012 vs September 2013 |
L2 cache | 4 MB vs 256 KB (per core) |
Thermal Design Power (TDP) | 25 Watt vs 130 Watt |
Compare benchmarks
CPU 1: Intel Xeon E5-1620 v2
CPU 2: AMD Opteron 3320 EE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E5-1620 v2 | AMD Opteron 3320 EE |
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PassMark - Single thread mark | 2022 | 774 |
PassMark - CPU mark | 6549 | 2675 |
Geekbench 4 - Single Core | 771 | |
Geekbench 4 - Multi-Core | 3220 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.986 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 86.752 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.613 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.351 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.181 |
Compare specifications (specs)
Intel Xeon E5-1620 v2 | AMD Opteron 3320 EE | |
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Essentials |
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Architecture codename | Ivy Bridge EP | Delhi |
Launch date | September 2013 | 2012 |
Launch price (MSRP) | $315 | |
Place in performance rating | 2281 | 2515 |
Price now | $329 | |
Processor Number | E5-1620V2 | |
Series | Intel® Xeon® Processor E5 v2 Family | AMD Opteron 3300 Series Processor |
Status | Launched | |
Value for money (0-100) | 8.46 | |
Vertical segment | Server | Server |
Family | AMD Opteron | |
OPN Tray | OS3320SJW4KHK | |
Performance |
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64 bit support | ||
Base frequency | 3.70 GHz | 1.9 GHz |
Bus Speed | 0 GT/s QPI | |
Die size | 160 mm | 315 mm |
L1 cache | 64 KB (per core) | 192 KB |
L2 cache | 256 KB (per core) | 4 MB |
L3 cache | 10240 KB (shared) | 8 MB |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 70°C | 70°C |
Maximum frequency | 3.90 GHz | 2.5 GHz |
Number of cores | 4 | 4 |
Number of QPI Links | 0 | |
Number of threads | 8 | 4 |
Transistor count | 1400 million | 1200 million |
VID voltage range | 0.65–1.30V | |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 4 | |
Maximum memory bandwidth | 59.7 GB/s | |
Maximum memory size | 256 GB | |
Supported memory types | DDR3 800/1066/1333/1600/1866 | DDR3 |
Supported memory frequency | 1400 MHz | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 52.5mm x 45.0 mm | |
Sockets supported | FCLGA2011 | AM3+ |
Thermal Design Power (TDP) | 130 Watt | 25 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Fused Multiply-Add (FMA) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |