Intel Xeon E5-1660 v3 vs Intel Xeon E5-2690
Comparative analysis of Intel Xeon E5-1660 v3 and Intel Xeon E5-2690 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon E5-1660 v3
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 2x more maximum memory size: 768 GB vs 384 GB
- Around 18% better performance in PassMark - Single thread mark: 1973 vs 1678
- Around 35% better performance in Geekbench 4 - Single Core: 907 vs 670
- Around 48% better performance in Geekbench 4 - Multi-Core: 7564 vs 5108
| Specifications (specs) | |
| Manufacturing process technology | 22 nm vs 32 nm |
| Maximum memory size | 768 GB vs 384 GB |
| Benchmarks | |
| PassMark - Single thread mark | 1973 vs 1678 |
| Geekbench 4 - Single Core | 907 vs 670 |
| Geekbench 4 - Multi-Core | 7564 vs 5108 |
Reasons to consider the Intel Xeon E5-2690
- Around 9% higher clock speed: 3.80 GHz vs 3.50 GHz
- Around 9% higher maximum core temperature: 72.0 °C vs 65.9°C
- Around 4% lower typical power consumption: 135 Watt vs 140 Watt
- Around 33% better performance in PassMark - CPU mark: 16687 vs 12519
| Specifications (specs) | |
| Maximum frequency | 3.80 GHz vs 3.50 GHz |
| Maximum core temperature | 72.0 °C vs 65.9°C |
| Max number of CPUs in a configuration | 2 vs 1 |
| Thermal Design Power (TDP) | 135 Watt vs 140 Watt |
| Benchmarks | |
| PassMark - CPU mark | 16687 vs 12519 |
Compare benchmarks
CPU 1: Intel Xeon E5-1660 v3
CPU 2: Intel Xeon E5-2690
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Xeon E5-1660 v3 | Intel Xeon E5-2690 |
|---|---|---|
| PassMark - Single thread mark | 1973 | 1678 |
| PassMark - CPU mark | 12519 | 16687 |
| Geekbench 4 - Single Core | 907 | 670 |
| Geekbench 4 - Multi-Core | 7564 | 5108 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 45.148 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 253.088 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 42.625 | |
| 3DMark Fire Strike - Physics Score | 0 |
Compare specifications (specs)
| Intel Xeon E5-1660 v3 | Intel Xeon E5-2690 | |
|---|---|---|
Essentials |
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| Architecture codename | Haswell | Sandy Bridge EP |
| Launch date | Q3'14 | March 2012 |
| Place in performance rating | 1313 | 1316 |
| Processor Number | E5-1660V3 | E5-2690 |
| Series | Intel® Xeon® Processor E5 v3 Family | Intel® Xeon® Processor E5 Family |
| Status | Launched | Discontinued |
| Vertical segment | Server | Server |
| Launch price (MSRP) | $397 | |
| Price now | $159 | |
| Value for money (0-100) | 25.42 | |
Performance |
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| 64 bit support | ||
| Base frequency | 3.00 GHz | 2.90 GHz |
| Bus Speed | 0 GT/s QPI | 8 GT/s QPI |
| Manufacturing process technology | 22 nm | 32 nm |
| Maximum core temperature | 65.9°C | 72.0 °C |
| Maximum frequency | 3.50 GHz | 3.80 GHz |
| Number of cores | 8 | 8 |
| Number of QPI Links | 0 | 2 |
| Number of threads | 16 | 16 |
| VID voltage range | 0.65–1.30V | 0.60V-1.35V |
| Die size | 435 mm | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| L3 cache | 20480 KB (shared) | |
| Transistor count | 2270 million | |
Memory |
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| Max memory channels | 4 | 4 |
| Maximum memory bandwidth | 68 GB/s | 51.2 GB/s |
| Maximum memory size | 768 GB | 384 GB |
| Supported memory types | DDR4 1333/1600/1866/2133 | DDR3 800/1066/1333/1600 |
| ECC memory support | ||
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 2 |
| Package Size | 52.5mm x 45.0 mm | 52.5mm x 45.0 mm |
| Sockets supported | FCLGA2011-3 | FCLGA2011 |
| Thermal Design Power (TDP) | 140 Watt | 135 Watt |
Peripherals |
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| Max number of PCIe lanes | 40 | 40 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | x4, x8, x16 | |
| Scalability | 1S Only | 2S Only |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX2 | Intel® AVX |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 46-bit | |
| Thermal Monitoring | ||
| Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
