Intel Xeon E5-2609 v3 vs Intel Xeon E5-2665
Comparative analysis of Intel Xeon E5-2609 v3 and Intel Xeon E5-2665 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), CompuBench 1.5 Desktop - Face Detection (mPixels/s).
Differences
Reasons to consider the Intel Xeon E5-2609 v3
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 2x more maximum memory size: 768 GB vs 384 GB
- Around 35% lower typical power consumption: 85 Watt vs 115 Watt
- 3.9x better performance in Geekbench 4 - Single Core: 2216 vs 573
- 2x better performance in Geekbench 4 - Multi-Core: 9427 vs 4647
Specifications (specs) | |
Manufacturing process technology | 22 nm vs 32 nm |
Maximum memory size | 768 GB vs 384 GB |
Thermal Design Power (TDP) | 85 Watt vs 115 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 2216 vs 573 |
Geekbench 4 - Multi-Core | 9427 vs 4647 |
Reasons to consider the Intel Xeon E5-2665
- 2 more cores, run more applications at once: 8 vs 6
- 10 more threads: 16 vs 6
- Around 15% higher maximum core temperature: 81.8°C vs 70.9°C
- Around 22% better performance in PassMark - Single thread mark: 1355 vs 1110
- Around 64% better performance in PassMark - CPU mark: 14117 vs 8590
Specifications (specs) | |
Number of cores | 8 vs 6 |
Number of threads | 16 vs 6 |
Maximum core temperature | 81.8°C vs 70.9°C |
Benchmarks | |
PassMark - Single thread mark | 1355 vs 1110 |
PassMark - CPU mark | 14117 vs 8590 |
Compare benchmarks
CPU 1: Intel Xeon E5-2609 v3
CPU 2: Intel Xeon E5-2665
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E5-2609 v3 | Intel Xeon E5-2665 |
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PassMark - Single thread mark | 1110 | 1355 |
PassMark - CPU mark | 8590 | 14117 |
Geekbench 4 - Single Core | 2216 | 573 |
Geekbench 4 - Multi-Core | 9427 | 4647 |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 32.12 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.279 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.17 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 31.866 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 10.42 |
Compare specifications (specs)
Intel Xeon E5-2609 v3 | Intel Xeon E5-2665 | |
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Essentials |
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Architecture codename | Haswell | Sandy Bridge EP |
Launch date | Q3'14 | March 2012 |
Place in performance rating | 1785 | 1816 |
Processor Number | E5-2609V3 | E5-2665 |
Series | Intel® Xeon® Processor E5 v3 Family | Intel® Xeon® Processor E5 Family |
Status | Discontinued | Discontinued |
Vertical segment | Server | Server |
Launch price (MSRP) | $142 | |
Price now | $141.50 | |
Value for money (0-100) | 24.14 | |
Performance |
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64 bit support | ||
Base frequency | 1.90 GHz | 2.40 GHz |
Bus Speed | 6.4 GT/s QPI | 8 GT/s QPI |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 70.9°C | 81.8°C |
Number of cores | 6 | 8 |
Number of QPI Links | 2 | 2 |
Number of threads | 6 | 16 |
VID voltage range | 0.65V–1.30V | 0.60V-1.35V |
Die size | 435 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 20480 KB (shared) | |
Maximum frequency | 3.10 GHz | |
Transistor count | 2270 million | |
Memory |
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Max memory channels | 4 | 4 |
Maximum memory bandwidth | 51 GB/s | 51.2 GB/s |
Maximum memory size | 768 GB | 384 GB |
Supported memory types | DDR4 1600 | DDR3 800/1066/1333/1600 |
ECC memory support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 2 |
Package Size | 52.5mm x 45mm | 52.5mm x 45.0mm |
Sockets supported | FCLGA2011-3 | FCLGA2011 |
Thermal Design Power (TDP) | 85 Watt | 115 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | 40 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S | 2S Only |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |