Intel Xeon E5-2650 v4 vs Intel Core i5-4570
Comparative analysis of Intel Xeon E5-2650 v4 and Intel Core i5-4570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Xeon E5-2650 v4
- 8 more cores, run more applications at once: 12 vs 4
- 20 more threads: 24 vs 4
- Around 10% higher maximum core temperature: 80°C vs 72.72°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 48x more maximum memory size: 1.5 TB vs 32 GB
- 4.4x better performance in PassMark - CPU mark: 22929 vs 5238
- 3.1x better performance in Geekbench 4 - Single Core: 2672 vs 861
- 3.1x better performance in Geekbench 4 - Multi-Core: 8676 vs 2767
| Specifications (specs) | |
| Number of cores | 12 vs 4 |
| Number of threads | 24 vs 4 |
| Maximum core temperature | 80°C vs 72.72°C |
| Manufacturing process technology | 14 nm vs 22 nm |
| Maximum memory size | 1.5 TB vs 32 GB |
| Max number of CPUs in a configuration | 2 vs 1 |
| Benchmarks | |
| PassMark - CPU mark | 22929 vs 5238 |
| Geekbench 4 - Single Core | 2672 vs 861 |
| Geekbench 4 - Multi-Core | 8676 vs 2767 |
Reasons to consider the Intel Core i5-4570
- Around 24% higher clock speed: 3.60 GHz vs 2.90 GHz
- Around 25% lower typical power consumption: 84 Watt vs 105 Watt
- Around 19% better performance in PassMark - Single thread mark: 2033 vs 1707
| Specifications (specs) | |
| Maximum frequency | 3.60 GHz vs 2.90 GHz |
| Thermal Design Power (TDP) | 84 Watt vs 105 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2033 vs 1707 |
Compare benchmarks
CPU 1: Intel Xeon E5-2650 v4
CPU 2: Intel Core i5-4570
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Xeon E5-2650 v4 | Intel Core i5-4570 |
|---|---|---|
| PassMark - Single thread mark | 1707 | 2033 |
| PassMark - CPU mark | 22929 | 5238 |
| Geekbench 4 - Single Core | 2672 | 861 |
| Geekbench 4 - Multi-Core | 8676 | 2767 |
| 3DMark Fire Strike - Physics Score | 2833 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.626 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 74.525 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.434 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.048 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.537 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 1143 | |
| GFXBench 4.0 - Manhattan (Frames) | 2080 | |
| GFXBench 4.0 - T-Rex (Frames) | 3326 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 1143 | |
| GFXBench 4.0 - Manhattan (Fps) | 2080 | |
| GFXBench 4.0 - T-Rex (Fps) | 3326 |
Compare specifications (specs)
| Intel Xeon E5-2650 v4 | Intel Core i5-4570 | |
|---|---|---|
Essentials |
||
| Architecture codename | Broadwell | Haswell |
| Launch date | Q1'16 | June 2013 |
| Place in performance rating | 841 | 1797 |
| Processor Number | E5-2650V4 | i5-4570 |
| Series | Intel® Xeon® Processor E5 v4 Family | 4th Generation Intel® Core™ i5 Processors |
| Status | Launched | Discontinued |
| Vertical segment | Server | Desktop |
| Launch price (MSRP) | $221 | |
| Price now | $174.99 | |
| Value for money (0-100) | 11.99 | |
Performance |
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| 64 bit support | ||
| Base frequency | 2.20 GHz | 3.20 GHz |
| Bus Speed | 9.6 GT/s QPI | 5 GT/s DMI2 |
| Manufacturing process technology | 14 nm | 22 nm |
| Maximum core temperature | 80°C | 72.72°C |
| Maximum frequency | 2.90 GHz | 3.60 GHz |
| Number of cores | 12 | 4 |
| Number of QPI Links | 2 | |
| Number of threads | 24 | 4 |
| VID voltage range | 0 | |
| Die size | 177 mm | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| L3 cache | 6144 KB (shared) | |
| Maximum case temperature (TCase) | 72 °C | |
| Transistor count | 1400 million | |
Memory |
||
| Max memory channels | 4 | 2 |
| Maximum memory bandwidth | 76.8 GB/s | 25.6 GB/s |
| Maximum memory size | 1.5 TB | 32 GB |
| Supported memory types | DDR4 1600/1866/2133/2400 | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 2 | 1 |
| Package Size | 45mm x 52.5mm | 37.5mm x 37.5mm |
| Sockets supported | FCLGA2011-3 | FCLGA1150 |
| Thermal Design Power (TDP) | 105 Watt | 84 Watt |
| Thermal Solution | PCG 2013D | |
Peripherals |
||
| Max number of PCIe lanes | 40 | 16 |
| PCI Express revision | 3.0 | Up to 3.0 |
| PCIe configurations | x4, x8, x16 | Up to 1x16, 2x8, 1x8+2x4 |
| Scalability | 2S | 1S Only |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Anti-Theft technology | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 46-bit | |
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® My WiFi technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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| Device ID | 0x412 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.15 GHz | |
| Graphics max frequency | 1.15 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 2 GB | |
| Processor graphics | Intel® HD Graphics 4600 | |
Graphics interfaces |
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| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| VGA | ||
| Wireless Display (WiDi) support | ||
Graphics image quality |
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| Max resolution over DisplayPort | 3840x2160@60Hz | |
| Max resolution over eDP | 3840x2160@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
| Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
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| DirectX | 11.2/12 | |
| OpenGL | 4.3 | |
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