Intel Xeon E7-4809 v3 vs Intel Xeon E7-8857 v2
Comparative analysis of Intel Xeon E7-4809 v3 and Intel Xeon E7-8857 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon E7-4809 v3
- 4 more threads: 16 vs 12
- Around 13% lower typical power consumption: 115 Watt vs 130 Watt
Number of threads | 16 vs 12 |
Thermal Design Power (TDP) | 115 Watt vs 130 Watt |
Reasons to consider the Intel Xeon E7-8857 v2
- 4 more cores, run more applications at once: 12 vs 8
- Around 4% higher maximum core temperature: 73°C vs 70°C
Number of cores | 12 vs 8 |
Maximum core temperature | 73°C vs 70°C |
Max number of CPUs in a configuration | 8 vs 4 |
Compare benchmarks
CPU 1: Intel Xeon E7-4809 v3
CPU 2: Intel Xeon E7-8857 v2
Name | Intel Xeon E7-4809 v3 | Intel Xeon E7-8857 v2 |
---|---|---|
PassMark - Single thread mark | 1935 | |
PassMark - CPU mark | 36304 |
Compare specifications (specs)
Intel Xeon E7-4809 v3 | Intel Xeon E7-8857 v2 | |
---|---|---|
Essentials |
||
Architecture codename | Haswell | Ivy Bridge |
Launch date | Q2'15 | Q1'14 |
Place in performance rating | not rated | 820 |
Processor Number | E7-4809V3 | E7-8857V2 |
Series | Intel® Xeon® Processor E7 v3 Family | Intel® Xeon® Processor E7 v2 Family |
Status | Launched | Launched |
Vertical segment | Server | Server |
Performance |
||
64 bit support | ||
Base frequency | 2.00 GHz | 3.00 GHz |
Bus Speed | 6.4 GT/s QPI | 8 GT/s QPI |
Manufacturing process technology | 22 nm | 22 nm |
Maximum core temperature | 70°C | 73°C |
Number of cores | 8 | 12 |
Number of QPI Links | 3 | 3 |
Number of threads | 16 | 12 |
Maximum frequency | 3.60 GHz | |
Memory |
||
Max memory channels | 4 | 4 |
Maximum memory bandwidth | 85 GB/s | 85 GB/s |
Maximum memory size | 1.5 TB | 1.5 TB |
Supported memory types | DDR4-1333/1600/1866, DDR3-1066/1333 | DDR3 1066/1333/1600 |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 4 | 8 |
Package Size | 52mm x 45mm | 52mm x 45mm |
Sockets supported | FCLGA2011 | FCLGA2011 |
Thermal Design Power (TDP) | 115 Watt | 130 Watt |
Peripherals |
||
Max number of PCIe lanes | 32 | 32 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x4, x8, x16 | x4, x8, x16 |
Scalability | S4S | S8S |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Instruction Replay Technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 46-bit | 46-bit |
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |