Intel Xeon E7-4809 v3 vs Intel Xeon E7-8870 v2
Comparative analysis of Intel Xeon E7-4809 v3 and Intel Xeon E7-8870 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon E7-4809 v3
- Around 13% lower typical power consumption: 115 Watt vs 130 Watt
| Thermal Design Power (TDP) | 115 Watt vs 130 Watt |
Reasons to consider the Intel Xeon E7-8870 v2
- 7 more cores, run more applications at once: 15 vs 8
- 14 more threads: 30 vs 16
- Around 4% higher maximum core temperature: 73°C vs 70°C
| Number of cores | 15 vs 8 |
| Number of threads | 30 vs 16 |
| Maximum core temperature | 73°C vs 70°C |
| Max number of CPUs in a configuration | 8 vs 4 |
Compare specifications (specs)
| Intel Xeon E7-4809 v3 | Intel Xeon E7-8870 v2 | |
|---|---|---|
Essentials |
||
| Architecture codename | Haswell | Ivy Bridge |
| Launch date | Q2'15 | Q1'14 |
| Place in performance rating | not rated | not rated |
| Processor Number | E7-4809V3 | E7-8870V2 |
| Series | Intel® Xeon® Processor E7 v3 Family | Intel® Xeon® Processor E7 v2 Family |
| Status | Launched | Launched |
| Vertical segment | Server | Server |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.00 GHz | 2.30 GHz |
| Bus Speed | 6.4 GT/s QPI | 8 GT/s QPI |
| Manufacturing process technology | 22 nm | 22 nm |
| Maximum core temperature | 70°C | 73°C |
| Number of cores | 8 | 15 |
| Number of QPI Links | 3 | 3 |
| Number of threads | 16 | 30 |
| Maximum frequency | 2.90 GHz | |
Memory |
||
| Max memory channels | 4 | 4 |
| Maximum memory bandwidth | 85 GB/s | 85 GB/s |
| Maximum memory size | 1.5 TB | 1.5 TB |
| Supported memory types | DDR4-1333/1600/1866, DDR3-1066/1333 | DDR3 1066/1333/1600 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 4 | 8 |
| Package Size | 52mm x 45mm | 52mm x 45mm |
| Sockets supported | FCLGA2011 | FCLGA2011 |
| Thermal Design Power (TDP) | 115 Watt | 130 Watt |
Peripherals |
||
| Max number of PCIe lanes | 32 | 32 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | x4, x8, x16 | x4, x8, x16 |
| Scalability | S4S | S8S |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX2 | Intel® AVX |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Instruction Replay Technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 46-bit | 46-bit |
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||