Intel Xeon E7-8870 v4 vs Intel Xeon E7-8860 v4

Comparative analysis of Intel Xeon E7-8870 v4 and Intel Xeon E7-8860 v4 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon E7-8870 v4

  • 2 more cores, run more applications at once: 20 vs 18
  • 4 more threads: 40 vs 36
  • Around 1% higher maximum core temperature: 76°C vs 75°C
Number of cores 20 vs 18
Number of threads 40 vs 36
Maximum core temperature 76°C vs 75°C

Reasons to consider the Intel Xeon E7-8860 v4

  • Around 7% higher clock speed: 3.20 GHz vs 3.00 GHz
Maximum frequency 3.20 GHz vs 3.00 GHz

Compare benchmarks

CPU 1: Intel Xeon E7-8870 v4
CPU 2: Intel Xeon E7-8860 v4

Name Intel Xeon E7-8870 v4 Intel Xeon E7-8860 v4
PassMark - Single thread mark 757
PassMark - CPU mark 22737

Compare specifications (specs)

Intel Xeon E7-8870 v4 Intel Xeon E7-8860 v4

Essentials

Architecture codename Broadwell Broadwell
Launch date Q2'16 Q2'16
Place in performance rating not rated 1821
Processor Number E7-8870V4 E7-8860V4
Series Intel® Xeon® Processor E7 v4 Family Intel® Xeon® Processor E7 v4 Family
Status Launched Launched
Vertical segment Server Server

Performance

64 bit support
Base frequency 2.10 GHz 2.20 GHz
Bus Speed 9.6 GT/s QPI 9.6 GT/s QPI
Manufacturing process technology 14 nm 14 nm
Maximum core temperature 76°C 75°C
Maximum frequency 3.00 GHz 3.20 GHz
Number of cores 20 18
Number of QPI Links 3 3
Number of threads 40 36

Memory

Max memory channels 4 4
Maximum memory bandwidth 85 GB/s 85 GB/s
Maximum memory size 3 TB 3 TB
Supported memory types DDR4-1333/1600/1866 DDR3-1066/1333/1600 DDR4-1333/1600/1866 DDR3-1066/1333/1600

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 8 8
Package Size 45mm x 52.5mm 45mm x 52.5mm
Sockets supported FCLGA2011 FCLGA2011
Thermal Design Power (TDP) 140 Watt 140 Watt

Peripherals

Max number of PCIe lanes 32 32
PCI Express revision 3.0 3.0
PCIe configurations x4, x8, x16 x4, x8, x16
Scalability S8S S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2 Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Instruction Replay Technology
Intel® TSX-NI
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 46-bit 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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