Intel Xeon E7-8870 v4 vs Intel Xeon E7-8867 v4
Comparative analysis of Intel Xeon E7-8870 v4 and Intel Xeon E7-8867 v4 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon E7-8870 v4
- 2 more cores, run more applications at once: 20 vs 18
- 4 more threads: 40 vs 36
- Around 18% lower typical power consumption: 140 Watt vs 165 Watt
Number of cores | 20 vs 18 |
Number of threads | 40 vs 36 |
Thermal Design Power (TDP) | 140 Watt vs 165 Watt |
Reasons to consider the Intel Xeon E7-8867 v4
- Around 10% higher clock speed: 3.30 GHz vs 3.00 GHz
- Around 5% higher maximum core temperature: 80°C vs 76°C
Maximum frequency | 3.30 GHz vs 3.00 GHz |
Maximum core temperature | 80°C vs 76°C |
Compare specifications (specs)
Intel Xeon E7-8870 v4 | Intel Xeon E7-8867 v4 | |
---|---|---|
Essentials |
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Architecture codename | Broadwell | Broadwell |
Launch date | Q2'16 | Q2'16 |
Place in performance rating | not rated | not rated |
Processor Number | E7-8870V4 | E7-8867V4 |
Series | Intel® Xeon® Processor E7 v4 Family | Intel® Xeon® Processor E7 v4 Family |
Status | Launched | Launched |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 2.10 GHz | 2.40 GHz |
Bus Speed | 9.6 GT/s QPI | 9.6 GT/s QPI |
Manufacturing process technology | 14 nm | 14 nm |
Maximum core temperature | 76°C | 80°C |
Maximum frequency | 3.00 GHz | 3.30 GHz |
Number of cores | 20 | 18 |
Number of QPI Links | 3 | 3 |
Number of threads | 40 | 36 |
Memory |
||
Max memory channels | 4 | 4 |
Maximum memory bandwidth | 85 GB/s | 85 GB/s |
Maximum memory size | 3 TB | 3 TB |
Supported memory types | DDR4-1333/1600/1866 DDR3-1066/1333/1600 | DDR4-1333/1600/1866 DDR3-1066/1333/1600 |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 8 | 8 |
Package Size | 45mm x 52.5mm | 45mm x 52.5mm |
Sockets supported | FCLGA2011 | FCLGA2011 |
Thermal Design Power (TDP) | 140 Watt | 165 Watt |
Peripherals |
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Max number of PCIe lanes | 32 | 32 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x4, x8, x16 | x4, x8, x16 |
Scalability | S8S | S8S |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Instruction Replay Technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 46-bit | 46-bit |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |