Intel Xeon E7450 vs Intel Xeon E5-2438L v3
Comparative analysis of Intel Xeon E7450 and Intel Xeon E5-2438L v3 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon E5-2438L v3
- 4 more cores, run more applications at once: 10 vs 6
- Around 22% higher maximum core temperature: 83 vs 68°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 29% lower typical power consumption: 70 Watt vs 90 Watt
Number of cores | 10 vs 6 |
Maximum core temperature | 83 vs 68°C |
Manufacturing process technology | 22 nm vs 45 nm |
Thermal Design Power (TDP) | 70 Watt vs 90 Watt |
Compare benchmarks
CPU 1: Intel Xeon E7450
CPU 2: Intel Xeon E5-2438L v3
Name | Intel Xeon E7450 | Intel Xeon E5-2438L v3 |
---|---|---|
PassMark - Single thread mark | 1016 | |
PassMark - CPU mark | 9849 |
Compare specifications (specs)
Intel Xeon E7450 | Intel Xeon E5-2438L v3 | |
---|---|---|
Essentials |
||
Architecture codename | Dunnington | Haswell |
Launch date | Q3'08 | Q1'15 |
Place in performance rating | 2009 | not rated |
Processor Number | E7450 | E5-2438LV3 |
Series | Legacy Intel Xeon Processors | Intel® Xeon® Processor E5 v3 Family |
Vertical segment | Server | Embedded |
Status | Launched | |
Performance |
||
64 bit support | ||
Base frequency | 2.40 GHz | 1.80 GHz |
Bus Speed | 1066 MHz | 8 GT/s QPI |
Die size | 503 mm2 | |
L3 cache | 12 MB L3 Cache | |
Manufacturing process technology | 45 nm | 22 nm |
Maximum core temperature | 68°C | 83 |
Number of cores | 6 | 10 |
Transistor count | 1900 million | |
VID voltage range | 0.900V-1.450V | 0.65V–1.30V |
Number of QPI Links | 1 | |
Number of threads | 20 | |
Compatibility |
||
Package Size | 53.3mm x 53.3mm | 42.5mmx45mm |
Sockets supported | PGA604 | FCLGA1356 |
Thermal Design Power (TDP) | 90 Watt | 70 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Instruction set extensions | Intel® AVX | |
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® TSX-NI | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
||
Max memory channels | 3 | |
Maximum memory bandwidth | 51.2 GB/s | |
Maximum memory size | 384 GB | |
Supported memory types | DDR3 800/1066/1333/1600 | |
Peripherals |
||
Max number of PCIe lanes | 24 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S |