Intel Xeon E7530 vs AMD Opteron 6128 HE
Comparative analysis of Intel Xeon E7530 and AMD Opteron 6128 HE processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon E7530
- 4 more threads: 12 vs 8
- Around 16% higher maximum core temperature: 64°C vs 55°C
- Around 14% better performance in PassMark - CPU mark: 7231 vs 6339
Specifications (specs) | |
Number of threads | 12 vs 8 |
Maximum core temperature | 64°C vs 55°C |
Benchmarks | |
PassMark - Single thread mark | 887 vs 883 |
PassMark - CPU mark | 7231 vs 6339 |
Reasons to consider the AMD Opteron 6128 HE
- 2 more cores, run more applications at once: 8 vs 6
- Around 50% higher clock speed: 3.2 GHz vs 2.13 GHz
- 1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 24% lower typical power consumption: 85 Watt vs 105 Watt
Number of cores | 8 vs 6 |
Maximum frequency | 3.2 GHz vs 2.13 GHz |
L3 cache | 12 MB vs 12 MB L3 Cache |
Thermal Design Power (TDP) | 85 Watt vs 105 Watt |
Compare benchmarks
CPU 1: Intel Xeon E7530
CPU 2: AMD Opteron 6128 HE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E7530 | AMD Opteron 6128 HE |
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PassMark - Single thread mark | 887 | 883 |
PassMark - CPU mark | 7231 | 6339 |
Compare specifications (specs)
Intel Xeon E7530 | AMD Opteron 6128 HE | |
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Essentials |
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Architecture codename | Nehalem EX | Maranello |
Launch date | Q1'10 | 29 Mar 2010 |
Place in performance rating | 2199 | 2235 |
Processor Number | E7530 | |
Series | Legacy Intel Xeon Processors | AMD Opteron 6100 series |
Vertical segment | Server | Server |
Family | AMD Opteron | |
Launch price (MSRP) | $523 | |
OPN Tray | OS6128VAT8EGO | |
Performance |
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Base frequency | 1.87 GHz | 2.0 GHz |
Bus Speed | 5.86 GT/s | |
L3 cache | 12 MB L3 Cache | 12 MB |
Manufacturing process technology | 45 nm | 45 nm |
Maximum core temperature | 64°C | 55°C |
Maximum frequency | 2.13 GHz | 3.2 GHz |
Number of cores | 6 | 8 |
Number of threads | 12 | 8 |
64 bit support | ||
Die size | 346 mm | |
L1 cache | 1 MB | |
L2 cache | 4 MB | |
Maximum case temperature (TCase) | 66 °C | |
Transistor count | 1808 million | |
Unlocked | ||
Compatibility |
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Sockets supported | FCLGA1567 | G34 |
Thermal Design Power (TDP) | 105 Watt | 85 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Fused Multiply-Add (FMA) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) | ||
Memory |
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Max memory channels | 4 | |
Maximum memory bandwidth | 42.7 GB/s | |
Supported memory types | DDR2-1066, DDR3-1333, LV DDR3-1066 |