Intel Xeon E7530 vs Intel Xeon E5-2670
Comparative analysis of Intel Xeon E7530 and Intel Xeon E5-2670 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E7530
- Around 10% lower typical power consumption: 105 Watt vs 115 Watt
| Thermal Design Power (TDP) | 105 Watt vs 115 Watt |
Reasons to consider the Intel Xeon E5-2670
- 2 more cores, run more applications at once: 8 vs 6
- 4 more threads: 16 vs 12
- Around 55% higher clock speed: 3.30 GHz vs 2.13 GHz
- Around 25% higher maximum core temperature: 80.0°C vs 64°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 1747626.7x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 68% better performance in PassMark - Single thread mark: 1489 vs 887
- 2.1x better performance in PassMark - CPU mark: 15492 vs 7231
| Specifications (specs) | |
| Number of cores | 8 vs 6 |
| Number of threads | 16 vs 12 |
| Maximum frequency | 3.30 GHz vs 2.13 GHz |
| Maximum core temperature | 80.0°C vs 64°C |
| Manufacturing process technology | 32 nm vs 45 nm |
| L3 cache | 20480 KB (shared) vs 12 MB L3 Cache |
| Benchmarks | |
| PassMark - Single thread mark | 1489 vs 887 |
| PassMark - CPU mark | 15492 vs 7231 |
Compare benchmarks
CPU 1: Intel Xeon E7530
CPU 2: Intel Xeon E5-2670
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Xeon E7530 | Intel Xeon E5-2670 |
|---|---|---|
| PassMark - Single thread mark | 887 | 1489 |
| PassMark - CPU mark | 7231 | 15492 |
| Geekbench 4 - Single Core | 602 | |
| Geekbench 4 - Multi-Core | 4635 | |
| 3DMark Fire Strike - Physics Score | 0 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 7.119 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 88.939 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.885 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.609 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 8.475 |
Compare specifications (specs)
| Intel Xeon E7530 | Intel Xeon E5-2670 | |
|---|---|---|
Essentials |
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| Architecture codename | Nehalem EX | Sandy Bridge EP |
| Launch date | Q1'10 | March 2012 |
| Place in performance rating | 2239 | 2226 |
| Processor Number | E7530 | E5-2670 |
| Series | Legacy Intel Xeon Processors | Intel® Xeon® Processor E5 Family |
| Vertical segment | Server | Server |
| Launch price (MSRP) | $145 | |
| Price now | $96.48 | |
| Status | Discontinued | |
| Value for money (0-100) | 37.05 | |
Performance |
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| Base frequency | 1.87 GHz | 2.60 GHz |
| Bus Speed | 5.86 GT/s | 8 GT/s QPI |
| L3 cache | 12 MB L3 Cache | 20480 KB (shared) |
| Manufacturing process technology | 45 nm | 32 nm |
| Maximum core temperature | 64°C | 80.0°C |
| Maximum frequency | 2.13 GHz | 3.30 GHz |
| Number of cores | 6 | 8 |
| Number of threads | 12 | 16 |
| 64 bit support | ||
| Die size | 435 mm | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| Number of QPI Links | 2 | |
| Transistor count | 2270 million | |
| VID voltage range | 0.60V-1.35V | |
Compatibility |
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| Sockets supported | FCLGA1567 | FCLGA2011 |
| Thermal Design Power (TDP) | 105 Watt | 115 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 2 | |
| Package Size | 52.5mm x 45.0mm | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Flex Memory Access | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
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| ECC memory support | ||
| Max memory channels | 4 | |
| Maximum memory bandwidth | 51.2 GB/s | |
| Maximum memory size | 384 GB | |
| Supported memory types | DDR3 800/1066/1333/1600 | |
Peripherals |
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| Max number of PCIe lanes | 40 | |
| PCI Express revision | 3.0 | |
| Scalability | 2S Only | |
