Intel Xeon E7540 vs Intel Xeon E3-1275 v2
Comparative analysis of Intel Xeon E7540 and Intel Xeon E3-1275 v2 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Xeon E7540
- 2 more cores, run more applications at once: 6 vs 4
- 4 more threads: 12 vs 8
- Around 42% better performance in PassMark - CPU mark: 9409 vs 6630
| Specifications (specs) | |
| Number of cores | 6 vs 4 |
| Number of threads | 12 vs 8 |
| Benchmarks | |
| PassMark - CPU mark | 9409 vs 6630 |
Reasons to consider the Intel Xeon E3-1275 v2
- Around 72% higher clock speed: 3.90 GHz vs 2.27 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- 466033.8x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 36% lower typical power consumption: 77 Watt vs 105 Watt
- 2.3x better performance in PassMark - Single thread mark: 2119 vs 911
| Specifications (specs) | |
| Maximum frequency | 3.90 GHz vs 2.27 GHz |
| Manufacturing process technology | 22 nm vs 45 nm |
| L3 cache | 8192 KB (shared) vs 18 MB L3 Cache |
| Thermal Design Power (TDP) | 77 Watt vs 105 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2119 vs 911 |
Compare benchmarks
CPU 1: Intel Xeon E7540
CPU 2: Intel Xeon E3-1275 v2
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Xeon E7540 | Intel Xeon E3-1275 v2 |
|---|---|---|
| PassMark - Single thread mark | 911 | 2119 |
| PassMark - CPU mark | 9409 | 6630 |
| Geekbench 4 - Single Core | 821 | |
| Geekbench 4 - Multi-Core | 3076 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.685 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 15.885 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.56 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.319 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.602 | |
| GFXBench 4.0 - T-Rex (Frames) | 2590 | |
| GFXBench 4.0 - T-Rex (Fps) | 2590 |
Compare specifications (specs)
| Intel Xeon E7540 | Intel Xeon E3-1275 v2 | |
|---|---|---|
Essentials |
||
| Architecture codename | Nehalem EX | Ivy Bridge |
| Launch date | Q1'10 | May 2012 |
| Place in performance rating | 2009 | 2005 |
| Processor Number | E7540 | E3-1275V2 |
| Series | Legacy Intel Xeon Processors | Intel® Xeon® Processor E3 v2 Family |
| Vertical segment | Server | Server |
| Launch price (MSRP) | $808 | |
| Price now | $394.72 | |
| Status | Launched | |
| Value for money (0-100) | 7.05 | |
Performance |
||
| Base frequency | 2.00 GHz | 3.50 GHz |
| Bus Speed | 6.4 GT/s | 5 GT/s DMI |
| L3 cache | 18 MB L3 Cache | 8192 KB (shared) |
| Manufacturing process technology | 45 nm | 22 nm |
| Maximum core temperature | 64°C | |
| Maximum frequency | 2.27 GHz | 3.90 GHz |
| Number of cores | 6 | 4 |
| Number of threads | 12 | 8 |
| 64 bit support | ||
| Die size | 160 mm | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| Transistor count | 1400 million | |
Compatibility |
||
| Sockets supported | FCLGA1567 | FCLGA1155 |
| Thermal Design Power (TDP) | 105 Watt | 77 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 32.77 GB | |
| Supported memory types | DDR3 1333/1600 | |
Graphics |
||
| Graphics base frequency | 650 MHz | |
| Graphics max dynamic frequency | 1.25 GHz | |
| Graphics max frequency | 1.25 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics P4000 | |
Graphics interfaces |
||
| Number of displays supported | 3 | |
Peripherals |
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| PCI Express revision | 3.0 | |
| PCIe configurations | 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4 | |
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