Intel Xeon Gold 5115 vs Intel Xeon E3-1286 v3
Comparative analysis of Intel Xeon Gold 5115 and Intel Xeon E3-1286 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Gold 5115
- 6 more cores, run more applications at once: 10 vs 4
- 12 more threads: 20 vs 8
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 24x more maximum memory size: 768 GB vs 32 GB
- 3.3x better performance in PassMark - CPU mark: 24760 vs 7418
Specifications (specs) | |
Number of cores | 10 vs 4 |
Number of threads | 20 vs 8 |
Manufacturing process technology | 14 nm vs 22 nm |
Maximum memory size | 768 GB vs 32 GB |
Benchmarks | |
PassMark - CPU mark | 24760 vs 7418 |
Reasons to consider the Intel Xeon E3-1286 v3
- Around 28% higher clock speed: 4.10 GHz vs 3.20 GHz
- Around 1% lower typical power consumption: 84 Watt vs 85 Watt
- Around 29% better performance in PassMark - Single thread mark: 2391 vs 1853
Specifications (specs) | |
Maximum frequency | 4.10 GHz vs 3.20 GHz |
Thermal Design Power (TDP) | 84 Watt vs 85 Watt |
Benchmarks | |
PassMark - Single thread mark | 2391 vs 1853 |
Compare benchmarks
CPU 1: Intel Xeon Gold 5115
CPU 2: Intel Xeon E3-1286 v3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon Gold 5115 | Intel Xeon E3-1286 v3 |
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PassMark - Single thread mark | 1853 | 2391 |
PassMark - CPU mark | 24760 | 7418 |
Compare specifications (specs)
Intel Xeon Gold 5115 | Intel Xeon E3-1286 v3 | |
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Essentials |
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Architecture codename | Skylake | Haswell |
Launch date | Q3'17 | Q2'14 |
Place in performance rating | 1023 | 1026 |
Processor Number | 5115 | E3-1286V3 |
Series | Intel® Xeon® Scalable Processors | Intel® Xeon® Processor E3 v3 Family |
Status | Launched | Discontinued |
Vertical segment | Server | Server |
Performance |
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Base frequency | 2.40 GHz | 3.70 GHz |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 76°C | |
Maximum frequency | 3.20 GHz | 4.10 GHz |
Number of cores | 10 | 4 |
Number of threads | 20 | 8 |
Number of Ultra Path Interconnect (UPI) Links | 2 | |
64 bit support | ||
Bus Speed | 5 GT/s DMI2 | |
Number of QPI Links | 0 | |
Memory |
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Max memory channels | 6 | 2 |
Maximum memory size | 768 GB | 32 GB |
Supported memory frequency | 2400 MHz | |
Supported memory types | DDR4-2400 | DDR3 and DDR3L 1333/1600 at 1.5V |
Maximum memory bandwidth | 25.6 GB/s | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 76.0mm x 56.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA3647 | FCLGA1150 |
Thermal Design Power (TDP) | 85 Watt | 84 Watt |
Max number of CPUs in a configuration | 1 | |
Thermal Solution | PCG 2013D | |
Peripherals |
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Max number of PCIe lanes | 48 | 16 |
PCI Express revision | 3.0 | 3.0 |
Scalability | S4S | 1S Only |
PCIe configurations | 1x16, 2x8, 1x8/2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Anti-Theft technology | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 1 | |
Speed Shift technology | ||
Idle States | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Stable Image Platform Program (SIPP) | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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Execution Units | 20 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.30 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 1.7 GB | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 3840x2160@60Hz | |
Max resolution over VGA | 2880x1800@60Hz | |
Graphics API support |
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DirectX | 11.2 | |
OpenGL | 4.3 |