Intel Xeon E3-1286 v3 processor review
Xeon E3-1286 v3 processor released by Intel; release date: Q2'14. The processor is designed for server-computers and based on Haswell microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 4.10 GHz. Manufacturing process technology - 22 nm.
Supported memory types: DDR3 and DDR3L 1333/1600 at 1.5V. Maximum memory size: 32 GB.
Supported socket types: FCLGA1150. Maximum number of processors in a configuration - 1. Power consumption (TDP): 84 Watt.
Benchmarks
PassMark Single thread mark |
|
|
||||
PassMark CPU mark |
|
|
Name | Value |
---|---|
PassMark - Single thread mark | 2391 |
PassMark - CPU mark | 7418 |
Specifications (specs)
Essentials |
|
Architecture codename | Haswell |
Launch date | Q2'14 |
Place in performance rating | 1025 |
Processor Number | E3-1286V3 |
Series | Intel® Xeon® Processor E3 v3 Family |
Status | Discontinued |
Vertical segment | Server |
Performance |
|
64 bit support | |
Base frequency | 3.70 GHz |
Bus Speed | 5 GT/s DMI2 |
Manufacturing process technology | 22 nm |
Maximum frequency | 4.10 GHz |
Number of cores | 4 |
Number of QPI Links | 0 |
Number of threads | 8 |
Memory |
|
Max memory channels | 2 |
Maximum memory bandwidth | 25.6 GB/s |
Maximum memory size | 32 GB |
Supported memory types | DDR3 and DDR3L 1333/1600 at 1.5V |
Graphics |
|
Execution Units | 20 |
Graphics base frequency | 350 MHz |
Graphics max dynamic frequency | 1.30 GHz |
Intel® Clear Video HD technology | |
Intel® Flexible Display Interface (Intel® FDI) | |
Intel® InTru™ 3D technology | |
Intel® Quick Sync Video | |
Max video memory | 1.7 GB |
Graphics interfaces |
|
DisplayPort | |
eDP | |
HDMI | |
Number of displays supported | 3 |
VGA | |
Graphics image quality |
|
Max resolution over DisplayPort | 3840x2160@60Hz |
Max resolution over HDMI 1.4 | 3840x2160@60Hz |
Max resolution over VGA | 2880x1800@60Hz |
Graphics API support |
|
DirectX | 11.2 |
OpenGL | 4.3 |
Compatibility |
|
Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 37.5mm x 37.5mm |
Sockets supported | FCLGA1150 |
Thermal Design Power (TDP) | 84 Watt |
Thermal Solution | PCG 2013D |
Peripherals |
|
Max number of PCIe lanes | 16 |
PCI Express revision | 3.0 |
PCIe configurations | 1x16, 2x8, 1x8/2x4 |
Scalability | 1S Only |
Security & Reliability |
|
Anti-Theft technology | |
Execute Disable Bit (EDB) | |
Intel® Identity Protection technology | |
Intel® OS Guard | |
Intel® Secure Key technology | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Fast Memory Access | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® Stable Image Platform Program (SIPP) | |
Intel® TSX-NI | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
|
Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |