Intel Xeon Gold 5512U vs AMD EPYC 7453
Comparative analysis of Intel Xeon Gold 5512U and AMD EPYC 7453 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Gold 5512U
- CPU is newer: launch date 2 year(s) 8 month(s) later
- Around 7% higher clock speed: 3.7 GHz vs 3.45 GHz
- Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 22% lower typical power consumption: 185 Watt vs 225 Watt
- Around 30% better performance in PassMark - Single thread mark: 3072 vs 2371
Specifications (specs) | |
Launch date | 14 Dec 2023 vs 15 Mar 2021 |
Maximum frequency | 3.7 GHz vs 3.45 GHz |
L1 cache | 80 KB (per core) vs 1792 KB |
L2 cache | 2 MB (per core) vs 14 MB |
Thermal Design Power (TDP) | 185 Watt vs 225 Watt |
Benchmarks | |
PassMark - Single thread mark | 3072 vs 2371 |
Reasons to consider the AMD EPYC 7453
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm+ vs 10 nm
- Around 22% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 33% better performance in PassMark - CPU mark: 80327 vs 60365
Specifications (specs) | |
Manufacturing process technology | 7 nm+ vs 10 nm |
L3 cache | 64 MB vs 52.5 MB (shared) |
Benchmarks | |
PassMark - CPU mark | 80327 vs 60365 |
Compare benchmarks
CPU 1: Intel Xeon Gold 5512U
CPU 2: AMD EPYC 7453
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon Gold 5512U | AMD EPYC 7453 |
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PassMark - Single thread mark | 3072 | 2371 |
PassMark - CPU mark | 60365 | 80327 |
Compare specifications (specs)
Intel Xeon Gold 5512U | AMD EPYC 7453 | |
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Essentials |
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Launch date | 14 Dec 2023 | 15 Mar 2021 |
Launch price (MSRP) | $1230 | $1570 |
Place in performance rating | 161 | 175 |
Architecture codename | Zen 3 | |
OPN PIB | 100-100000319WOF | |
OPN Tray | 100-000000319 | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.1 GHz | 2.75 GHz |
Die size | 2x 763 mm² | |
L1 cache | 80 KB (per core) | 1792 KB |
L2 cache | 2 MB (per core) | 14 MB |
L3 cache | 52.5 MB (shared) | 64 MB |
Manufacturing process technology | 10 nm | 7 nm+ |
Maximum case temperature (TCase) | 89°C | |
Maximum core temperature | 98°C | |
Maximum frequency | 3.7 GHz | 3.45 GHz |
Number of cores | 28 | 28 |
Number of threads | 56 | 56 |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4-3200 |
Max memory channels | 8 | |
Maximum memory bandwidth | 190.73 GB/s | |
Maximum memory size | 4 TB | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Sockets supported | 4677 | SP3 |
Thermal Design Power (TDP) | 185 Watt | 225 Watt |
Configurable TDP | 225-240 Watt | |
Socket Count | 2P | |
Peripherals |
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PCIe configurations | Gen 5, 80 Lanes, (CPU only) | |
Max number of PCIe lanes | 128 | |
PCI Express revision | 4.0 | |
Advanced Technologies |
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AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
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AMD Virtualization (AMD-V™) |