Intel Xeon Gold 6338 vs AMD EPYC 7352

Comparative analysis of Intel Xeon Gold 6338 and AMD EPYC 7352 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Xeon Gold 6338

AMD EPYC 7352

Differences

Reasons to consider the Intel Xeon Gold 6338

8 more cores, run more applications at once: 32 vs 24
16 more threads: 64 vs 48
Around 50% higher maximum memory size: 6 TB vs 4 TB
Around 7% better performance in PassMark - Single thread mark: 2185 vs 2040
Around 4% better performance in PassMark - CPU mark: 68563 vs 65921

Specifications (specs)
Number of cores	32 vs 24
Number of threads	64 vs 48
Maximum memory size	6 TB vs 4 TB
Benchmarks
PassMark - Single thread mark	2185 vs 2040
PassMark - CPU mark	68563 vs 65921

Reasons to consider the AMD EPYC 7352

A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 10 nm
2.7x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 32% lower typical power consumption: 155 Watt vs 205 Watt

Manufacturing process technology	7 nm, 14 nm vs 10 nm
L3 cache	128 MB vs 48 MB
Thermal Design Power (TDP)	155 Watt vs 205 Watt

Compare benchmarks

CPU 1: Intel Xeon Gold 6338
CPU 2: AMD EPYC 7352

PassMark - Single thread mark

CPU 1

CPU 2

2185

2040

PassMark - CPU mark

CPU 1

CPU 2

68563

65921

Name	Intel Xeon Gold 6338	AMD EPYC 7352
PassMark - Single thread mark	2185	2040
PassMark - CPU mark	68563	65921

Compare specifications (specs)

	Intel Xeon Gold 6338	AMD EPYC 7352
Essentials
Architecture codename	Ice Lake	Zen 2
Launch date	Q2'21	7 Aug 2019
Launch price (MSRP)	$2990	$1350
Place in performance rating	311	381
Processor Number	6338
Series	3rd Generation Intel Xeon Scalable Processors
Vertical segment	Server	Server
OPN PIB		100-100000077WOF
OPN Tray		100-000000077
Performance
Base frequency	2.00 GHz	2.3 GHz
L3 cache	48 MB	128 MB
Manufacturing process technology	10 nm	7 nm, 14 nm
Maximum core temperature	81°C
Maximum frequency	3.20 GHz	3.2 GHz
Number of cores	32	24
Number of threads	64	48
L1 cache		1.5 MB
L2 cache		12 MB
Memory
Max memory channels	8	8
Maximum memory size	6 TB	4 TB
Supported memory frequency	3200 MHz
Supported memory types	DDR4-3200	DDR4-3200
ECC memory support
Maximum memory bandwidth		190.7 GB/s
Compatibility
Package Size	77.5mm x 56.5mm
Sockets supported	FCLGA4189	SP3
Thermal Design Power (TDP)	205 Watt	155 Watt
Max number of CPUs in a configuration		2
Socket Count		1P/2P
Peripherals
Max number of PCIe lanes	64	128
PCI Express revision	4.0	4.0
Scalability	2S
PCIe configurations		x16, x8
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Instruction set extensions	Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units	2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)