AMD EPYC 8324P vs Intel Xeon Gold 6338

Comparative analysis of AMD EPYC 8324P and Intel Xeon Gold 6338 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 8324P

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 10 nm
  • 2.7x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 14% lower typical power consumption: 180 Watt vs 205 Watt
  • Around 8% better performance in PassMark - Single thread mark: 2367 vs 2185
Specifications (specs)
Manufacturing process technology 5 nm vs 10 nm
L3 cache 128 MB (shared) vs 48 MB
Thermal Design Power (TDP) 180 Watt vs 205 Watt
Benchmarks
PassMark - Single thread mark 2367 vs 2185

Reasons to consider the Intel Xeon Gold 6338

  • Around 7% higher clock speed: 3.20 GHz vs 3 GHz
  • Around 20% better performance in PassMark - CPU mark: 68563 vs 57127
Specifications (specs)
Maximum frequency 3.20 GHz vs 3 GHz
Benchmarks
PassMark - CPU mark 68563 vs 57127

Compare benchmarks

CPU 1: AMD EPYC 8324P
CPU 2: Intel Xeon Gold 6338

PassMark - Single thread mark
CPU 1
CPU 2
2367
2185
PassMark - CPU mark
CPU 1
CPU 2
57127
68563
Name AMD EPYC 8324P Intel Xeon Gold 6338
PassMark - Single thread mark 2367 2185
PassMark - CPU mark 57127 68563

Compare specifications (specs)

AMD EPYC 8324P Intel Xeon Gold 6338

Essentials

Launch date 18 Sep 2023 Q2'21
Launch price (MSRP) $1895 $2990
Place in performance rating 365 310
Architecture codename Ice Lake
Processor Number 6338
Series 3rd Generation Intel Xeon Scalable Processors
Vertical segment Server

Performance

Base frequency 2.65 GHz 2.00 GHz
Die size 4x 73 mm²
L1 cache 64 KB (per core)
L2 cache 1 MB (per core)
L3 cache 128 MB (shared) 48 MB
Manufacturing process technology 5 nm 10 nm
Maximum case temperature (TCase) 75°C
Maximum frequency 3 GHz 3.20 GHz
Number of cores 32 32
Number of threads 64 64
Transistor count 35,500 million
Unlocked
Maximum core temperature 81°C

Memory

ECC memory support
Supported memory types DDR5 DDR4-3200
Max memory channels 8
Maximum memory size 6 TB
Supported memory frequency 3200 MHz

Compatibility

Configurable TDP 155-225 Watt
Max number of CPUs in a configuration 1
Sockets supported SP6 FCLGA4189
Thermal Design Power (TDP) 180 Watt 205 Watt
Package Size 77.5mm x 56.5mm

Peripherals

PCIe configurations Gen 5, 96 Lanes, (CPU only)
Max number of PCIe lanes 64
PCI Express revision 4.0
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Instruction set extensions Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)