AMD EPYC 8324P vs Intel Xeon Gold 6338

Comparative analysis of AMD EPYC 8324P and Intel Xeon Gold 6338 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC 8324P

Intel Xeon Gold 6338

Differences

Reasons to consider the AMD EPYC 8324P

A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 10 nm
2.7x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 14% lower typical power consumption: 180 Watt vs 205 Watt
Around 8% better performance in PassMark - Single thread mark: 2367 vs 2185

Specifications (specs)
Manufacturing process technology	5 nm vs 10 nm
L3 cache	128 MB (shared) vs 48 MB
Thermal Design Power (TDP)	180 Watt vs 205 Watt
Benchmarks
PassMark - Single thread mark	2367 vs 2185

Reasons to consider the Intel Xeon Gold 6338

Around 7% higher clock speed: 3.20 GHz vs 3 GHz
Around 20% better performance in PassMark - CPU mark: 68563 vs 57127

Specifications (specs)
Maximum frequency	3.20 GHz vs 3 GHz
Benchmarks
PassMark - CPU mark	68563 vs 57127

Compare benchmarks

CPU 1: AMD EPYC 8324P
CPU 2: Intel Xeon Gold 6338

PassMark - Single thread mark

CPU 1

CPU 2

2367

2185

PassMark - CPU mark

CPU 1

CPU 2

57127

68563

Name	AMD EPYC 8324P	Intel Xeon Gold 6338
PassMark - Single thread mark	2367	2185
PassMark - CPU mark	57127	68563

Compare specifications (specs)

	AMD EPYC 8324P	Intel Xeon Gold 6338
Essentials
Launch date	18 Sep 2023	Q2'21
Launch price (MSRP)	$1895	$2990
Place in performance rating	366	309
Architecture codename		Ice Lake
Processor Number		6338
Series		3rd Generation Intel Xeon Scalable Processors
Vertical segment		Server
Performance
Base frequency	2.65 GHz	2.00 GHz
Die size	4x 73 mm²
L1 cache	64 KB (per core)
L2 cache	1 MB (per core)
L3 cache	128 MB (shared)	48 MB
Manufacturing process technology	5 nm	10 nm
Maximum case temperature (TCase)	75°C
Maximum frequency	3 GHz	3.20 GHz
Number of cores	32	32
Number of threads	64	64
Transistor count	35,500 million
Unlocked
Maximum core temperature		81°C
Memory
ECC memory support
Supported memory types	DDR5	DDR4-3200
Max memory channels		8
Maximum memory size		6 TB
Supported memory frequency		3200 MHz
Compatibility
Configurable TDP	155-225 Watt
Max number of CPUs in a configuration	1
Sockets supported	SP6	FCLGA4189
Thermal Design Power (TDP)	180 Watt	205 Watt
Package Size		77.5mm x 56.5mm
Peripherals
PCIe configurations	Gen 5, 96 Lanes, (CPU only)
Max number of PCIe lanes		64
PCI Express revision		4.0
Scalability		2S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Instruction set extensions		Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)