Intel Xeon MP 3.66 vs Intel Pentium 4 HT 620

Comparative analysis of Intel Xeon MP 3.66 and Intel Pentium 4 HT 620 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon MP 3.66

  • Around 31% higher clock speed: 3.67 GHz vs 2.8 GHz
  • Around 8% higher maximum core temperature: 73°C vs 67.7°C
Maximum frequency 3.67 GHz vs 2.8 GHz
Maximum core temperature 73°C vs 67.7°C

Reasons to consider the Intel Pentium 4 HT 620

  • Around 75% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 31% lower typical power consumption: 84 Watt vs 110 Watt
L1 cache 28 KB vs 16 KB
L2 cache 2048 KB vs 1024 KB
Thermal Design Power (TDP) 84 Watt vs 110 Watt

Compare benchmarks

CPU 1: Intel Xeon MP 3.66
CPU 2: Intel Pentium 4 HT 620

Name Intel Xeon MP 3.66 Intel Pentium 4 HT 620
Geekbench 4 - Single Core 801
Geekbench 4 - Multi-Core 906

Compare specifications (specs)

Intel Xeon MP 3.66 Intel Pentium 4 HT 620

Essentials

Architecture codename Cranford Prescott
Launch date March 2005 February 2005
Place in performance rating not rated 2527
Series Legacy Intel® Xeon® Processors Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Server Desktop
Processor Number 620

Performance

64 bit support
Base frequency 3.66 GHz 2.80 GHz
Bus Speed 667 MHz FSB 800 MHz FSB
Die size 112 mm2 135 mm2
L1 cache 16 KB 28 KB
L2 cache 1024 KB 2048 KB
Manufacturing process technology 90 nm 90 nm
Maximum core temperature 73°C 67.7°C
Maximum frequency 3.67 GHz 2.8 GHz
Number of cores 1 1
Transistor count 125 million 169 million
VID voltage range 1.2875V-1.4000V 1.200V-1.400V
Maximum case temperature (TCase) 68 °C

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 53.3mm x 53.3mm
Sockets supported PPGA604 PLGA775
Thermal Design Power (TDP) 110 Watt 84 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)

Memory

Supported memory types DDR1, DDR2, DDR3

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