Intel Xeon Phi 3120P vs Intel Xeon Phi 5120D
Comparative analysis of Intel Xeon Phi 3120P and Intel Xeon Phi 5120D processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon Phi 3120P
- Around 5% higher clock speed: 1.1 GHz vs 1.05 GHz
Maximum frequency | 1.1 GHz vs 1.05 GHz |
Reasons to consider the Intel Xeon Phi 5120D
- 3 more cores, run more applications at once: 60 vs 57
- Around 5% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 5% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 33% higher maximum memory size: 8 GB vs 6 GB
- Around 22% lower typical power consumption: 245 Watt vs 300 Watt
Number of cores | 60 vs 57 |
L1 cache | 32 KB (per core) vs 32 KB (per core) |
L2 cache | 512 KB (per core) vs 512 KB (per core) |
Maximum memory size | 8 GB vs 6 GB |
Thermal Design Power (TDP) | 245 Watt vs 300 Watt |
Compare specifications (specs)
Intel Xeon Phi 3120P | Intel Xeon Phi 5120D | |
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Essentials |
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Architecture codename | Knights Corner | Knights Corner |
Launch date | June 2013 | June 2013 |
Place in performance rating | not rated | not rated |
Processor Number | 3120P | 5120D |
Series | Intel® Xeon Phi™ x100 Product Family | Intel® Xeon Phi™ x100 Product Family |
Status | Discontinued | Discontinued |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 1.10 GHz | 1.05 GHz |
Die size | 350 mm | 350 mm |
L1 cache | 32 KB (per core) | 32 KB (per core) |
L2 cache | 512 KB (per core) | 512 KB (per core) |
Manufacturing process technology | 22 nm | 22 nm |
Maximum frequency | 1.1 GHz | 1.05 GHz |
Number of cores | 57 | 60 |
Transistor count | 5000 million | 5000 million |
Memory |
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Max memory channels | 12 | 16 |
Maximum memory bandwidth | 240 GB/s | 352 GB/s |
Maximum memory size | 6 GB | 8 GB |
Supported memory types | DDR3, DDR4 | DDR3, DDR4 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Thermal Design Power (TDP) | 300 Watt | 245 Watt |
Peripherals |
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PCI Express revision | 2.0 | 2.0 |
Security & Reliability |
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Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Instruction set extensions | Intel® IMCI | Intel® IMCI |
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |