Intel Xeon Phi 3120P vs Intel Xeon Phi 7120P
Comparative analysis of Intel Xeon Phi 3120P and Intel Xeon Phi 7120P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon Phi 7120P
- 4 more cores, run more applications at once: 61 vs 57
- Around 21% higher clock speed: 1.33 GHz vs 1.1 GHz
- Around 7% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 7% more L2 cache; more data can be stored in the L2 cache for quick access later
- 2.7x more maximum memory size: 16 GB vs 6 GB
| Number of cores | 61 vs 57 |
| Maximum frequency | 1.33 GHz vs 1.1 GHz |
| L1 cache | 32 KB (per core) vs 32 KB (per core) |
| L2 cache | 512 KB (per core) vs 512 KB (per core) |
| Maximum memory size | 16 GB vs 6 GB |
Compare specifications (specs)
| Intel Xeon Phi 3120P | Intel Xeon Phi 7120P | |
|---|---|---|
Essentials |
||
| Architecture codename | Knights Corner | Knights Corner |
| Launch date | June 2013 | June 2013 |
| Place in performance rating | not rated | not rated |
| Processor Number | 3120P | 7120P |
| Series | Intel® Xeon Phi™ x100 Product Family | Intel® Xeon Phi™ x100 Product Family |
| Status | Discontinued | Discontinued |
| Vertical segment | Server | Server |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.10 GHz | 1.24 GHz |
| Die size | 350 mm | 350 mm |
| L1 cache | 32 KB (per core) | 32 KB (per core) |
| L2 cache | 512 KB (per core) | 512 KB (per core) |
| Manufacturing process technology | 22 nm | 22 nm |
| Maximum frequency | 1.1 GHz | 1.33 GHz |
| Number of cores | 57 | 61 |
| Transistor count | 5000 million | 5000 million |
Memory |
||
| Max memory channels | 12 | 16 |
| Maximum memory bandwidth | 240 GB/s | 352 GB/s |
| Maximum memory size | 6 GB | 16 GB |
| Supported memory types | DDR3, DDR4 | DDR3, DDR4 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Thermal Design Power (TDP) | 300 Watt | 300 Watt |
Peripherals |
||
| PCI Express revision | 2.0 | 2.0 |
Security & Reliability |
||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Instruction set extensions | Intel® IMCI | Intel® IMCI |
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||