Intel Xeon Phi 7230 vs Intel Xeon Phi 7250F

Comparative analysis of Intel Xeon Phi 7230 and Intel Xeon Phi 7250F processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

Intel Xeon Phi 7230

Intel Xeon Phi 7250F

Differences

Reasons to consider the Intel Xeon Phi 7230

Around 7% lower typical power consumption: 215 Watt vs 230 Watt

Thermal Design Power (TDP)	215 Watt vs 230 Watt

Reasons to consider the Intel Xeon Phi 7250F

4 more cores, run more applications at once: 68 vs 64
Around 7% higher clock speed: 1.60 GHz vs 1.50 GHz
Around 6% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 6% more L2 cache; more data can be stored in the L2 cache for quick access later

Number of cores	68 vs 64
Maximum frequency	1.60 GHz vs 1.50 GHz
L1 cache	32 KB (per core) vs 32 KB (per core)
L2 cache	512 KB (per core) vs 512 KB (per core)

Compare specifications (specs)

	Intel Xeon Phi 7230	Intel Xeon Phi 7250F
Essentials
Architecture codename	Knights Landing	Knights Landing
Launch date	June 2016	June 2016
Place in performance rating	not rated	not rated
Processor Number	7230	7250F
Series	Intel® Xeon Phi™ x200 Product Family	Intel® Xeon Phi™ x200 Product Family
Status	Launched	Launched
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	1.30 GHz	1.40 GHz
L1 cache	32 KB (per core)	32 KB (per core)
L2 cache	512 KB (per core)	512 KB (per core)
Manufacturing process technology	14 nm	14 nm
Maximum frequency	1.50 GHz	1.60 GHz
Number of cores	64	68
Transistor count	8000 million	8000 million
VID voltage range	0.550-1.125V	0.550-1.125V
Memory
ECC memory support
Max memory channels	6	6
Maximum memory bandwidth	115.2 GB/s	115.2 GB/s
Maximum memory size	384 GB	384 GB
Supported memory types	DDR4-2400	DDR4-2400
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Sockets supported	SVLCLGA3647	SVLCLGA3647
Thermal Design Power (TDP)	215 Watt	230 Watt
Peripherals
Max number of PCIe lanes	36	4
PCI Express revision	3.0	3.0
PCIe configurations	x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1	x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Idle States
Instruction set extensions	Intel® AVX-512	Intel® AVX-512
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)