Intel Xeon Phi 7230 vs Intel Xeon Phi 7250F

Comparative analysis of Intel Xeon Phi 7230 and Intel Xeon Phi 7250F processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

 

Differences

Reasons to consider the Intel Xeon Phi 7230

  • Around 7% lower typical power consumption: 215 Watt vs 230 Watt
Thermal Design Power (TDP) 215 Watt vs 230 Watt

Reasons to consider the Intel Xeon Phi 7250F

  • 4 more cores, run more applications at once: 68 vs 64
  • Around 7% higher clock speed: 1.60 GHz vs 1.50 GHz
  • Around 6% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 6% more L2 cache; more data can be stored in the L2 cache for quick access later
Number of cores 68 vs 64
Maximum frequency 1.60 GHz vs 1.50 GHz
L1 cache 32 KB (per core) vs 32 KB (per core)
L2 cache 512 KB (per core) vs 512 KB (per core)

Compare specifications (specs)

Intel Xeon Phi 7230 Intel Xeon Phi 7250F

Essentials

Architecture codename Knights Landing Knights Landing
Launch date June 2016 June 2016
Place in performance rating not rated not rated
Processor Number 7230 7250F
Series Intel® Xeon Phi™ x200 Product Family Intel® Xeon Phi™ x200 Product Family
Status Launched Launched
Vertical segment Server Server

Performance

64 bit support
Base frequency 1.30 GHz 1.40 GHz
L1 cache 32 KB (per core) 32 KB (per core)
L2 cache 512 KB (per core) 512 KB (per core)
Manufacturing process technology 14 nm 14 nm
Maximum frequency 1.50 GHz 1.60 GHz
Number of cores 64 68
Transistor count 8000 million 8000 million
VID voltage range 0.550-1.125V 0.550-1.125V

Memory

ECC memory support
Max memory channels 6 6
Maximum memory bandwidth 115.2 GB/s 115.2 GB/s
Maximum memory size 384 GB 384 GB
Supported memory types DDR4-2400 DDR4-2400

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Sockets supported SVLCLGA3647 SVLCLGA3647
Thermal Design Power (TDP) 215 Watt 230 Watt

Peripherals

Max number of PCIe lanes 36 4
PCI Express revision 3.0 3.0
PCIe configurations x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1 x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot

Advanced Technologies

Idle States
Instruction set extensions Intel® AVX-512 Intel® AVX-512
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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