Intel Xeon Phi 7290F vs AMD A9-9410 SoC

Comparative analysis of Intel Xeon Phi 7290F and AMD A9-9410 SoC processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

Intel Xeon Phi 7290F

AMD A9-9410 SoC

Differences

Reasons to consider the Intel Xeon Phi 7290F

CPU is newer: launch date 1 month(s) later
70 more cores, run more applications at once: 72 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 28 nm
9x more L1 cache, more data can be stored in the L1 cache for quick access later
18x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	June 2016 vs May 2016
Number of cores	72 vs 2
Manufacturing process technology	14 nm vs 28 nm
L1 cache	32 KB (per core) vs 128 KB (per core)
L2 cache	512 KB (per core) vs 1024 KB (per core)

Reasons to consider the AMD A9-9410 SoC

Around 71% higher clock speed: 2.9 GHz vs 1.70 GHz
10.4x lower typical power consumption: 25 Watt vs 260 Watt

Maximum frequency	2.9 GHz vs 1.70 GHz
Thermal Design Power (TDP)	25 Watt vs 260 Watt

Compare specifications (specs)

	Intel Xeon Phi 7290F	AMD A9-9410 SoC
Essentials
Architecture codename	Knights Landing	Stoney Ridge
Launch date	June 2016	May 2016
Place in performance rating	not rated	not rated
Processor Number	7290F
Series	Intel® Xeon Phi™ x200 Product Family
Status	Launched
Vertical segment	Server	Desktop
Performance
64 bit support
Base frequency	1.50 GHz
L1 cache	32 KB (per core)	128 KB (per core)
L2 cache	512 KB (per core)	1024 KB (per core)
Manufacturing process technology	14 nm	28 nm
Maximum frequency	1.70 GHz	2.9 GHz
Number of cores	72	2
Transistor count	8000 million	1200 million
VID voltage range	0.550-1.125V
Die size		124 mm
Maximum case temperature (TCase)		74 °C
Memory
ECC memory support
Max memory channels	6
Maximum memory bandwidth	115.2 GB/s
Maximum memory size	384 GB
Supported memory types	DDR4-2400	DDR4
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Sockets supported	SVLCLGA3647
Thermal Design Power (TDP)	260 Watt	25 Watt
Peripherals
Max number of PCIe lanes	4
PCI Express revision	3.0
PCIe configurations	x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Idle States
Instruction set extensions	Intel® AVX-512
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Fused Multiply-Add (FMA)
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)