Intel Xeon Platinum 8168 vs AMD Opteron 3250 HE
Comparative analysis of Intel Xeon Platinum 8168 and AMD Opteron 3250 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Platinum 8168
- Around 6% higher clock speed: 3.70 GHz vs 3.5 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 2.1x better performance in PassMark - Single thread mark: 2132 vs 1003
- 26.7x better performance in PassMark - CPU mark: 55063 vs 2061
Specifications (specs) | |
Maximum frequency | 3.70 GHz vs 3.5 GHz |
Manufacturing process technology | 14 nm vs 32 nm |
Benchmarks | |
PassMark - Single thread mark | 2132 vs 1003 |
PassMark - CPU mark | 55063 vs 2061 |
Reasons to consider the AMD Opteron 3250 HE
- 4.6x lower typical power consumption: 45 Watt vs 205 Watt
Thermal Design Power (TDP) | 45 Watt vs 205 Watt |
Compare benchmarks
CPU 1: Intel Xeon Platinum 8168
CPU 2: AMD Opteron 3250 HE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon Platinum 8168 | AMD Opteron 3250 HE |
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PassMark - Single thread mark | 2132 | 1003 |
PassMark - CPU mark | 55063 | 2061 |
Compare specifications (specs)
Intel Xeon Platinum 8168 | AMD Opteron 3250 HE | |
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Essentials |
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Architecture codename | Skylake | |
Launch date | Q3'17 | |
Place in performance rating | 404 | 2157 |
Processor Number | 8168 | |
Series | Intel® Xeon® Scalable Processors | AMD Opteron 3200 Series Processor |
Status | Launched | |
Vertical segment | Server | Server |
Family | AMD Opteron | |
OPN PIB | OS3250HOW4MGUBOX | |
OPN Tray | OS3250HOW4MGU | |
Performance |
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Base frequency | 2.70 GHz | 2.5 GHz |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 85°C | |
Maximum frequency | 3.70 GHz | 3.5 GHz |
Number of cores | 24 | |
Number of threads | 48 | |
Number of Ultra Path Interconnect (UPI) Links | 3 | |
L1 cache | 192 KB | |
L2 cache | 4 MB | |
L3 cache | 4 MB | |
Unlocked | ||
Memory |
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Max memory channels | 6 | |
Maximum memory size | 768 GB | |
Supported memory frequency | 2666 MHz | 2000 MHz |
Supported memory types | DDR4-2666 | DDR3 |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 76.0mm x 56.5mm | |
Sockets supported | FCLGA3647 | AM3+ |
Thermal Design Power (TDP) | 205 Watt | 45 Watt |
Peripherals |
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Max number of PCIe lanes | 48 | |
PCI Express revision | 3.0 | |
Scalability | S8S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |