Intel Xeon Platinum 8468 vs AMD EPYC 9654

Comparative analysis of Intel Xeon Platinum 8468 and AMD EPYC 9654 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Xeon Platinum 8468

AMD EPYC 9654

Differences

Reasons to consider the Intel Xeon Platinum 8468

CPU is newer: launch date 2 month(s) later
Around 3% lower typical power consumption: 350 Watt vs 360 Watt
Around 14% better performance in PassMark - Single thread mark: 3156 vs 2774

Specifications (specs)
Launch date	10 Jan 2023 vs 10 Nov 2022
Thermal Design Power (TDP)	350 Watt vs 360 Watt
Benchmarks
PassMark - Single thread mark	3156 vs 2774

Reasons to consider the AMD EPYC 9654

48 more cores, run more applications at once: 96 vs 48
96 more threads: 192 vs 96
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 10 nm
Around 60% more L1 cache; more data can be stored in the L1 cache for quick access later
3.7x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 15% better performance in PassMark - CPU mark: 146454 vs 126838

Specifications (specs)
Number of cores	96 vs 48
Number of threads	192 vs 96
Manufacturing process technology	5 nm vs 10 nm
L1 cache	6 MB vs 80 KB (per core)
L3 cache	384 MB vs 105 MB
Benchmarks
PassMark - CPU mark	146454 vs 126838

Compare benchmarks

CPU 1: Intel Xeon Platinum 8468
CPU 2: AMD EPYC 9654

PassMark - Single thread mark

CPU 1

CPU 2

3156

2774

PassMark - CPU mark

CPU 1

CPU 2

126838

146454

Name	Intel Xeon Platinum 8468	AMD EPYC 9654
PassMark - Single thread mark	3156	2774
PassMark - CPU mark	126838	146454

Compare specifications (specs)

	Intel Xeon Platinum 8468	AMD EPYC 9654
Essentials
Launch date	10 Jan 2023	10 Nov 2022
Launch price (MSRP)	$7214	$11805
Place in performance rating	14	10
Architecture codename		Zen 4
OPN Tray		100-100000789
Performance
Base frequency	2.1 GHz	2.4 GHz
Die size	4x 477 mm²	72 mm²
L1 cache	80 KB (per core)	6 MB
L2 cache	2 MB (per core)	96 MB
L3 cache	105 MB	384 MB
Manufacturing process technology	10 nm	5 nm
Maximum case temperature (TCase)	79°C
Maximum frequency	3.8 GHz
Number of cores	48	96
Number of threads	96	192
Unlocked
Maximum core temperature		3.7 GHz
Transistor count		78840 million
Memory
ECC memory support
Supported memory types	DDR5	DDR5-4800
Max memory channels		12
Compatibility
Max number of CPUs in a configuration	2	2
Sockets supported	4677	SP5
Thermal Design Power (TDP)	350 Watt	360 Watt
Configurable TDP		320-400 Watt
Package Size		FC-LGA6096
Peripherals
PCIe configurations	Gen 5, 80 Lanes, (CPU only)
Max number of PCIe lanes		128
PCI Express revision		5.0