Intel Xeon Platinum 8468 vs AMD EPYC 9454

Comparative analysis of Intel Xeon Platinum 8468 and AMD EPYC 9454 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon Platinum 8468

  • CPU is newer: launch date 2 month(s) later
  • Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 2097152x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 430080x more L3 cache, more data can be stored in the L3 cache for quick access later
Launch date 10 Jan 2023 vs 10 Nov 2022
L1 cache 80 KB (per core) vs 64K (per core)
L2 cache 2 MB (per core) vs 1MB (per core)
L3 cache 105 MB vs 256MB (shared)

Reasons to consider the AMD EPYC 9454

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 10 nm
  • Around 21% lower typical power consumption: 290 Watt vs 350 Watt
  • Around 9% better performance in PassMark - Single thread mark: 2982 vs 2735
  • Around 11% better performance in PassMark - CPU mark: 129701 vs 116663
Specifications (specs)
Manufacturing process technology 5 nm vs 10 nm
Thermal Design Power (TDP) 290 Watt vs 350 Watt
Benchmarks
PassMark - Single thread mark 2982 vs 2735
PassMark - CPU mark 129701 vs 116663

Compare benchmarks

CPU 1: Intel Xeon Platinum 8468
CPU 2: AMD EPYC 9454

PassMark - Single thread mark
CPU 1
CPU 2
2735
2982
PassMark - CPU mark
CPU 1
CPU 2
116663
129701
Name Intel Xeon Platinum 8468 AMD EPYC 9454
PassMark - Single thread mark 2735 2982
PassMark - CPU mark 116663 129701

Compare specifications (specs)

Intel Xeon Platinum 8468 AMD EPYC 9454

Essentials

Launch date 10 Jan 2023 10 Nov 2022
Launch price (MSRP) $7214 $5225
Place in performance rating 47 20

Performance

Base frequency 2.1 GHz 2.75 GHz
Die size 4x 477 mm² 8x 72 mm²
L1 cache 80 KB (per core) 64K (per core)
L2 cache 2 MB (per core) 1MB (per core)
L3 cache 105 MB 256MB (shared)
Manufacturing process technology 10 nm 5 nm
Maximum case temperature (TCase) 79°C
Maximum frequency 3.8 GHz 3.8 GHz
Number of cores 48 48
Number of threads 96 96
Unlocked
Transistor count 52,560 million

Memory

ECC memory support
Supported memory types DDR5 DDR5-4800 MHz, Twelve-channel

Compatibility

Max number of CPUs in a configuration 2 2
Sockets supported 4677 SP5
Thermal Design Power (TDP) 350 Watt 290 Watt
Configurable TDP 240-300 Watt

Peripherals

PCIe configurations Gen 5, 80 Lanes, (CPU only) Gen 5, 128 Lanes, (CPU only)