Intel Xeon Silver 4215R vs AMD EPYC 7261
Comparative analysis of Intel Xeon Silver 4215R and AMD EPYC 7261 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Silver 4215R
- Around 38% higher clock speed: 4.00 GHz vs 2.9 GHz
- Around 31% lower typical power consumption: 130 Watt vs 155/170 Watt
Maximum frequency | 4.00 GHz vs 2.9 GHz |
Thermal Design Power (TDP) | 130 Watt vs 155/170 Watt |
Reasons to consider the AMD EPYC 7261
- 5.8x more L3 cache, more data can be stored in the L3 cache for quick access later
L3 cache | 64 MB vs 11 MB |
Compare benchmarks
CPU 1: Intel Xeon Silver 4215R
CPU 2: AMD EPYC 7261
Name | Intel Xeon Silver 4215R | AMD EPYC 7261 |
---|---|---|
PassMark - Single thread mark | 1962 | |
PassMark - CPU mark | 23954 |
Compare specifications (specs)
Intel Xeon Silver 4215R | AMD EPYC 7261 | |
---|---|---|
Essentials |
||
Architecture codename | Cascade Lake | |
Launch date | 24 Feb 2020 | |
Launch price (MSRP) | $794 | |
Place in performance rating | 1025 | not rated |
Processor Number | 4215R | |
Series | 2nd Generation Intel Xeon Scalable Processors | AMD EPYC 7000 Series |
Status | Launched | |
Vertical segment | Server | Server |
Family | AMD EPYC | |
OPN Tray | PS7261BEV8RAF | |
Performance |
||
Base frequency | 3.20 GHz | 2.5 GHz |
L1 cache | 512 KB | |
L2 cache | 8 MB | |
L3 cache | 11 MB | 64 MB |
Manufacturing process technology | 14 nm | |
Maximum core temperature | 79°C | |
Maximum frequency | 4.00 GHz | 2.9 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Number of Ultra Path Interconnect (UPI) Links | 2 | |
Memory |
||
Max memory channels | 6 | 8 |
Maximum memory size | 1 TB | |
Supported memory frequency | 2400 MHz | 2400 MHz/2666 MHz |
Supported memory types | DDR4-2400 | |
Compatibility |
||
Package Size | 76.0mm x 56.5mm | |
Sockets supported | FCLGA3647 | |
Thermal Design Power (TDP) | 130 Watt | 155/170 Watt |
Socket Count | 1P/2P | |
Peripherals |
||
Max number of PCIe lanes | 48 | |
PCI Express revision | 3.0 | |
Scalability | 2S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Number of AVX-512 FMA Units | 1 | |
Speed Shift technology | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |