Intel Xeon W-1370 vs AMD Ryzen Threadripper 3960X
Comparative analysis of Intel Xeon W-1370 and AMD Ryzen Threadripper 3960X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon W-1370
- CPU is newer: launch date 1 year(s) 5 month(s) later
- Around 13% higher clock speed: 5.10 GHz vs 4.5 GHz
- Around 47% higher maximum core temperature: 100°C vs 68 °C
- 3.5x lower typical power consumption: 80 Watt vs 280 Watt
- Around 30% better performance in PassMark - Single thread mark: 3475 vs 2681
Specifications (specs) | |
Launch date | 6 May 2021 vs 25 Nov 2019 |
Maximum frequency | 5.10 GHz vs 4.5 GHz |
Maximum core temperature | 100°C vs 68 °C |
Thermal Design Power (TDP) | 80 Watt vs 280 Watt |
Benchmarks | |
PassMark - Single thread mark | 3475 vs 2681 |
Reasons to consider the AMD Ryzen Threadripper 3960X
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 2.4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- 8x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.3x better performance in PassMark - CPU mark: 54861 vs 23449
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Manufacturing process technology | 7 nm vs 14 nm |
L1 cache | 1.5 MB vs 640 KB |
L2 cache | 12 MB vs 4 MB |
L3 cache | 128 MB vs 16 MB |
Benchmarks | |
PassMark - CPU mark | 54861 vs 23449 |
Compare benchmarks
CPU 1: Intel Xeon W-1370
CPU 2: AMD Ryzen Threadripper 3960X
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-1370 | AMD Ryzen Threadripper 3960X |
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PassMark - Single thread mark | 3475 | 2681 |
PassMark - CPU mark | 23449 | 54861 |
Geekbench 4 - Single Core | 1267 | |
Geekbench 4 - Multi-Core | 19997 | |
3DMark Fire Strike - Physics Score | 14014 |
Compare specifications (specs)
Intel Xeon W-1370 | AMD Ryzen Threadripper 3960X | |
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Essentials |
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Architecture codename | Rocket Lake | Zen 2 |
Launch date | 6 May 2021 | 25 Nov 2019 |
Launch price (MSRP) | $362 - $365 | $1399 |
Place in performance rating | 281 | 346 |
Processor Number | W-1370 | |
Series | Intel Xeon W Processor | |
Status | Launched | |
Vertical segment | Workstation | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.90 GHz | 3.8 GHz |
Bus Speed | 8 GT/s | |
L1 cache | 640 KB | 1.5 MB |
L2 cache | 4 MB | 12 MB |
L3 cache | 16 MB | 128 MB |
Manufacturing process technology | 14 nm | 7 nm |
Maximum core temperature | 100°C | 68 °C |
Maximum frequency | 5.10 GHz | 4.5 GHz |
Number of cores | 24 | |
Number of threads | 48 | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 4 |
Maximum memory bandwidth | 50 GB/s | 512 GB |
Maximum memory size | 128 GB | |
Supported memory types | DDR4-3200 | DDR4-3200 |
ECC memory support | ||
Graphics |
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Device ID | 0x4C90 | |
Execution Units | 32 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.30 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics P750 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 5120 x 3200 @60Hz | |
Max resolution over eDP | 5120 x 3200 @60Hz | |
Graphics API support |
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DirectX | 12.1 | |
OpenGL | 4.5 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Package Size | 37.5 mm x 37.5 mm | |
Sockets supported | FCLGA1200 | sTRX4 |
Thermal Design Power (TDP) | 80 Watt | 280 Watt |
Thermal Solution | PCG 2019B | |
Peripherals |
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Max number of PCIe lanes | 20 | 64 |
PCI Express revision | 4.0 | 4.0 |
PCIe configurations | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |