Intel Xeon X5460 vs Intel Xeon 3.06

Comparative analysis of Intel Xeon X5460 and Intel Xeon 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon X5460

  • CPU is newer: launch date 4 year(s) 4 month(s) later
  • 3 more cores, run more applications at once: 4 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
  • 32x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 24x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date 12 Nov 2007 vs July 2003
Number of cores 4 vs 1
Manufacturing process technology 45 nm vs 130 nm
L1 cache 256 KB vs 8 KB
L2 cache 12 MB vs 512 KB

Reasons to consider the Intel Xeon 3.06

  • Around 24% lower typical power consumption: 97 Watt vs 120 Watt
Thermal Design Power (TDP) 97 Watt vs 120 Watt

Compare benchmarks

CPU 1: Intel Xeon X5460
CPU 2: Intel Xeon 3.06

Name Intel Xeon X5460 Intel Xeon 3.06
3DMark Fire Strike - Physics Score 0
PassMark - Single thread mark 0
PassMark - CPU mark 491

Compare specifications (specs)

Intel Xeon X5460 Intel Xeon 3.06

Essentials

Architecture codename Harpertown Gallatin
Launch date 12 Nov 2007 July 2003
Launch price (MSRP) $1172
Place in performance rating 3275 3250
Processor Number X5460
Vertical segment Server Server

Performance

64 bit support
Base frequency 3.16 GHz
Bus Speed 1333 MHz
L1 cache 256 KB 8 KB
L2 cache 12 MB 512 KB
Manufacturing process technology 45 nm 130 nm
Maximum case temperature (TCase) 63 °C
Number of cores 4 1
Number of threads 4
Transistor count 820 million 286 million
VID voltage range 0.85V - 1.35V
Die size 237 mm
L3 cache 2048 KB
Maximum frequency 3.07 GHz

Compatibility

Sockets supported LGA771 604
Thermal Design Power (TDP) 120 Watt 97 Watt
Max number of CPUs in a configuration 2

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® VT-x with Extended Page Tables (EPT)

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