Intel Xeon X5460 vs Intel Xeon E-2224
Comparative analysis of Intel Xeon X5460 and Intel Xeon E-2224 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon X5460
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
L2 cache | 12 MB vs 1 MB |
Reasons to consider the Intel Xeon E-2224
- CPU is newer: launch date 11 year(s) 6 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- Around 69% lower typical power consumption: 71 Watt vs 120 Watt
Launch date | 27 May 2019 vs 12 Nov 2007 |
Manufacturing process technology | 14 nm vs 45 nm |
Thermal Design Power (TDP) | 71 Watt vs 120 Watt |
Compare benchmarks
CPU 1: Intel Xeon X5460
CPU 2: Intel Xeon E-2224
Name | Intel Xeon X5460 | Intel Xeon E-2224 |
---|---|---|
3DMark Fire Strike - Physics Score | 0 | |
PassMark - Single thread mark | 2553 | |
PassMark - CPU mark | 7259 |
Compare specifications (specs)
Intel Xeon X5460 | Intel Xeon E-2224 | |
---|---|---|
Essentials |
||
Architecture codename | Harpertown | Coffee Lake |
Launch date | 12 Nov 2007 | 27 May 2019 |
Launch price (MSRP) | $1172 | $193 |
Place in performance rating | 3358 | 949 |
Processor Number | X5460 | E-2224 |
Vertical segment | Server | Server |
Performance |
||
64 bit support | ||
Base frequency | 3.16 GHz | 3.40 GHz |
Bus Speed | 1333 MHz | |
L1 cache | 256 KB | 256 KB |
L2 cache | 12 MB | 1 MB |
Manufacturing process technology | 45 nm | 14 nm |
Maximum case temperature (TCase) | 63 °C | |
Number of cores | 4 | 4 |
Number of threads | 4 | 4 |
Transistor count | 820 million | |
VID voltage range | 0.85V - 1.35V | |
L3 cache | 8 MB | |
Maximum core temperature | 69.3 °C | |
Maximum frequency | 4.60 GHz | |
Compatibility |
||
Sockets supported | LGA771 | FCLGA1151 |
Thermal Design Power (TDP) | 120 Watt | 71 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
||
ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 39.74 GB/s | |
Maximum memory size | 128 GB | |
Supported memory types | DDR4-2666 | |
Peripherals |
||
Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | 1x16,2x8,1x8+2x4 | |
Scalability | 1S Only |