Intel Xeon X5460 vs Intel Xeon E-2224
Comparative analysis of Intel Xeon X5460 and Intel Xeon E-2224 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon X5460
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
| L2 cache | 12 MB vs 1 MB |
Reasons to consider the Intel Xeon E-2224
- CPU is newer: launch date 11 year(s) 6 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- Around 69% lower typical power consumption: 71 Watt vs 120 Watt
| Launch date | 27 May 2019 vs 12 Nov 2007 |
| Manufacturing process technology | 14 nm vs 45 nm |
| Thermal Design Power (TDP) | 71 Watt vs 120 Watt |
Compare benchmarks
CPU 1: Intel Xeon X5460
CPU 2: Intel Xeon E-2224
| Name | Intel Xeon X5460 | Intel Xeon E-2224 |
|---|---|---|
| 3DMark Fire Strike - Physics Score | 0 | |
| PassMark - Single thread mark | 2570 | |
| PassMark - CPU mark | 7321 |
Compare specifications (specs)
| Intel Xeon X5460 | Intel Xeon E-2224 | |
|---|---|---|
Essentials |
||
| Architecture codename | Harpertown | Coffee Lake |
| Launch date | 12 Nov 2007 | 27 May 2019 |
| Launch price (MSRP) | $1172 | $193 |
| Place in performance rating | 3368 | 940 |
| Processor Number | X5460 | E-2224 |
| Vertical segment | Server | Server |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.16 GHz | 3.40 GHz |
| Bus Speed | 1333 MHz | |
| L1 cache | 256 KB | 256 KB |
| L2 cache | 12 MB | 1 MB |
| Manufacturing process technology | 45 nm | 14 nm |
| Maximum case temperature (TCase) | 63 °C | |
| Number of cores | 4 | 4 |
| Number of threads | 4 | 4 |
| Transistor count | 820 million | |
| VID voltage range | 0.85V - 1.35V | |
| L3 cache | 8 MB | |
| Maximum core temperature | 69.3 °C | |
| Maximum frequency | 4.60 GHz | |
Compatibility |
||
| Sockets supported | LGA771 | FCLGA1151 |
| Thermal Design Power (TDP) | 120 Watt | 71 Watt |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Intel® Optane™ Memory Supported | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 39.74 GB/s | |
| Maximum memory size | 128 GB | |
| Supported memory types | DDR4-2666 | |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | 1x16,2x8,1x8+2x4 | |
| Scalability | 1S Only | |