AMD FirePro 2270 PCIe x1 videocard review

FirePro 2270 PCIe x1 videocard released by AMD; release date: 31 January 2011. The videocard is designed for workstation-computers and based on TeraScale 2 microarchitecture codenamed Cedar.

Core clock speed - 600 MHz. Texture fill rate - 4.8 GTexel / s. Pipelines - 80. Floating-point performance - 96 gflops. Manufacturing process technology - 40 nm. Transistors count - 292 million. Power consumption (TDP) - 15 Watt.

Memory type: GDDR3. Maximum RAM amount - 512 MB. Memory bus width - 64 Bit. Memory clock speed - 1200 MHz. Memory bandwidth - 9.6 GB / s.

Specifications (specs)

Essentials
Architecture	TeraScale 2
Code name	Cedar
Launch date	31 January 2011
Place in performance rating	not rated
Type	Workstation
Technical info
Core clock speed	600 MHz
Floating-point performance	96 gflops
Manufacturing process technology	40 nm
Pipelines	80
Texture fill rate	4.8 GTexel / s
Thermal Design Power (TDP)	15 Watt
Transistor count	292 million

Video outputs and ports
Display Connectors	1x DMS-59
Compatibility, dimensions and requirements
Interface	PCIe 2.0 x1
Length	170 mm
Supplementary power connectors	None
API support
DirectX	11.2 (11_0)
OpenGL	4.4
Memory
Maximum RAM amount	512 MB
Memory bandwidth	9.6 GB / s
Memory bus width	64 Bit
Memory clock speed	1200 MHz
Memory type	GDDR3