AMD Radeon HD 7470M videocard review

AMD Radeon HD 7470M

Radeon HD 7470M videocard released by AMD; release date: 7 January 2012. The videocard is designed for laptop-computers and based on TeraScale 2 microarchitecture codenamed Seymour.

Core clock speed - 750 MHz. Boost clock speed - 800 MHz. Texture fill rate - 6 GTexel / s. Pipelines - 160. Floating-point performance - 240.0 gflops. Manufacturing process technology - 40 nm. Transistors count - 370 million. Power consumption (TDP) - 7 Watt.

Memory type: DDR3 / GDDR5. Maximum RAM amount - 1 GB. Memory bus width - 64 Bit. Memory clock speed - 1800 MHz. Memory bandwidth - 14.4 GB / s. Shared memory - 0.

Benchmarks

PassMark
G3D Mark
Top 1 GPU
This GPU
38582
408
PassMark
G2D Mark
Top 1 GPU
This GPU
1295
393
Geekbench
OpenCL
Top 1 GPU
This GPU
345616
3322
GFXBench 4.0
T-Rex
Top 1 GPU
This GPU
69225 Frames
3074 Frames
GFXBench 4.0
T-Rex
Top 1 GPU
This GPU
69225.000 Fps
3074.000 Fps
3DMark Fire Strike
Graphics Score
Top 1 GPU
This GPU
36466
0
GFXBench 4.0
Manhattan
Top 1 GPU
This GPU
27823 Frames
1422 Frames
GFXBench 4.0
Manhattan
Top 1 GPU
This GPU
27823.000 Fps
1422.000 Fps
Name Value
PassMark - G3D Mark 408
PassMark - G2D Mark 393
Geekbench - OpenCL 3322
GFXBench 4.0 - T-Rex 3074 Frames
GFXBench 4.0 - T-Rex 3074.000 Fps
3DMark Fire Strike - Graphics Score 0
GFXBench 4.0 - Manhattan 1422 Frames
GFXBench 4.0 - Manhattan 1422.000 Fps

Games performance

The Elder Scrolls V: Skyrim (2011)

Low, 1280x72024.25
Medium, 1366x76816.65
High, 1366x76811.30

Battlefield 3 (2011)

Low, 1024x76818.40
Medium, 1366x76811.90
High, 1366x7689.10

Deus Ex Human Revolution (2011)

Low, 1024x76848.70
High, 1366x76816.50

StarCraft 2 (2010)

Low, 1024x768128.40
Medium, 1360x76822.40
High, 1360x76812.30

Metro 2033 (2010)

Low, 800x60026.60
Medium, 1360x76813.30

Specifications (specs)

Essentials

Architecture TeraScale 2
Code name Seymour
Launch date 7 January 2012
Place in performance rating 1032
Type Laptop

Technical info

Boost clock speed 800 MHz
Core clock speed 750 MHz
Floating-point performance 240.0 gflops
Manufacturing process technology 40 nm
Pipelines 160
Texture fill rate 6 GTexel / s
Thermal Design Power (TDP) 7 Watt
Transistor count 370 million

Video outputs and ports

Display Connectors No outputs

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16

API support

DirectX 11.2 (11_0)
OpenGL 4.4

Memory

Maximum RAM amount 1 GB
Memory bandwidth 14.4 GB / s
Memory bus width 64 Bit
Memory clock speed 1800 MHz
Memory type DDR3 / GDDR5
Shared memory 0