ATI Mobility Radeon HD 5470 videocard review

ATI Mobility Radeon HD 5470

Mobility Radeon HD 5470 videocard released by ATI; release date: 7 January 2010. The videocard is designed for laptop-computers and based on TeraScale 2 microarchitecture codenamed Park.

Core clock speed - 750 MHz. Texture fill rate - 6 GTexel / s. Pipelines - 80. Floating-point performance - 120 gflops. Manufacturing process technology - 40 nm. Transistors count - 292 million. Power consumption (TDP) - 15 Watt.

Memory type: DDR2, GDDR2, DDR3, GDDR3, GDDR5. Maximum RAM amount - 512 MB. Memory bus width - 64 Bit. Memory clock speed - 3200 MHz. Memory bandwidth - 25.6 GB / s. Shared memory - 0.

Benchmarks

PassMark
G3D Mark
Top 1 GPU
This GPU
38707
236
PassMark
G2D Mark
Top 1 GPU
This GPU
1305
362
Geekbench
OpenCL
Top 1 GPU
This GPU
352097
2112
GFXBench 4.0
Manhattan
Top 1 GPU
This GPU
27823 Frames
1247 Frames
GFXBench 4.0
Manhattan
Top 1 GPU
This GPU
27823.000 Fps
1247.000 Fps
GFXBench 4.0
T-Rex
Top 1 GPU
This GPU
69225 Frames
1679 Frames
GFXBench 4.0
T-Rex
Top 1 GPU
This GPU
69225.000 Fps
1679.000 Fps
Name Value
PassMark - G3D Mark 236
PassMark - G2D Mark 362
Geekbench - OpenCL 2112
GFXBench 4.0 - Manhattan 1247 Frames
GFXBench 4.0 - Manhattan 1247.000 Fps
GFXBench 4.0 - T-Rex 1679 Frames
GFXBench 4.0 - T-Rex 1679.000 Fps

Games performance

StarCraft 2 (2010)

Low, 1024x768102.35
Medium, 1360x76819.65
High, 1360x76812.15

Metro 2033 (2010)

Low, 800x60031.15
Medium, 1360x76814.90

Left 4 Dead (2008)

Low, 640x48060.00
High, 1024x76844.00

Supreme Commander - FA Bench (2007)

Low, 1024x76829.44
Medium, 1024x76822.77
High, 1024x76819.28

Crysis - GPU Benchmark (2007)

Low, 1024x76861.05
Medium, 1024x76824.87
High, 1024x76813.62

World in Conflict - Benchmark (2007)

Low, 800x60079.00
Medium, 1024x76837.00
High, 1024x76817.00

Specifications (specs)

Essentials

Architecture TeraScale 2
Code name Park
Launch date 7 January 2010
Place in performance rating 1060
Type Laptop

Technical info

Core clock speed 750 MHz
Floating-point performance 120 gflops
Manufacturing process technology 40 nm
Pipelines 80
Texture fill rate 6 GTexel / s
Thermal Design Power (TDP) 15 Watt
Transistor count 292 million

Video outputs and ports

Display Connectors No outputs

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16

API support

DirectX 11.2 (11_0)
OpenGL 4.4

Memory

Maximum RAM amount 512 MB
Memory bandwidth 25.6 GB / s
Memory bus width 64 Bit
Memory clock speed 3200 MHz
Memory type DDR2, GDDR2, DDR3, GDDR3, GDDR5
Shared memory 0