AMD Radeon HD 8350 OEM vs NVIDIA GeForce FX Go5300
Comparative analysis of AMD Radeon HD 8350 OEM and NVIDIA GeForce FX Go5300 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.
Differences
Reasons to consider the AMD Radeon HD 8350 OEM
- Videocard is newer: launch date 9 year(s) 10 month(s) later
- 2.4x more core clock speed: 650 MHz vs 275 MHz
- 4.7x more texture fill rate: 5.2 GTexel / s vs 1.1 GTexel / s
- A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 150 nm
- 16x more maximum memory size: 1 GB vs 64 MB
- 2.7x more memory clock speed: 1334 MHz vs 500 MHz
- Around 40% better performance in PassMark - G2D Mark: 222 vs 159
- 12.5x better performance in PassMark - G3D Mark: 163 vs 13
Specifications (specs) | |
Launch date | 8 January 2013 vs 1 March 2003 |
Core clock speed | 650 MHz vs 275 MHz |
Texture fill rate | 5.2 GTexel / s vs 1.1 GTexel / s |
Manufacturing process technology | 40 nm vs 150 nm |
Maximum memory size | 1 GB vs 64 MB |
Memory clock speed | 1334 MHz vs 500 MHz |
Benchmarks | |
PassMark - G2D Mark | 222 vs 159 |
PassMark - G3D Mark | 163 vs 13 |
Compare benchmarks
GPU 1: AMD Radeon HD 8350 OEM
GPU 2: NVIDIA GeForce FX Go5300
PassMark - G2D Mark |
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PassMark - G3D Mark |
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Name | AMD Radeon HD 8350 OEM | NVIDIA GeForce FX Go5300 |
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PassMark - G2D Mark | 222 | 159 |
PassMark - G3D Mark | 163 | 13 |
Geekbench - OpenCL | 2883 |
Compare specifications (specs)
AMD Radeon HD 8350 OEM | NVIDIA GeForce FX Go5300 | |
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Essentials |
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Architecture | TeraScale 2 | Rankine |
Code name | Cedar | NV34 A1 |
Launch date | 8 January 2013 | 1 March 2003 |
Place in performance rating | 1067 | 1065 |
Type | Desktop | Desktop |
Technical info |
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Core clock speed | 650 MHz | 275 MHz |
Floating-point performance | 104.0 gflops | |
Manufacturing process technology | 40 nm | 150 nm |
Pipelines | 80 | |
Texture fill rate | 5.2 GTexel / s | 1.1 GTexel / s |
Thermal Design Power (TDP) | 19 Watt | |
Transistor count | 292 million | 45 million |
Video outputs and ports |
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Display Connectors | 1x DVI, 1x HDMI | No outputs |
Compatibility, dimensions and requirements |
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Interface | PCIe 2.0 x16 | AGP 8x |
Length | 168 mm | |
Supplementary power connectors | None | |
API support |
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DirectX | 11.2 | 9.0a |
OpenGL | 4.4 | 1.5 (2.1) |
Memory |
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Maximum RAM amount | 1 GB | 64 MB |
Memory bandwidth | 10.67 GB / s | 8 GB / s |
Memory bus width | 64 Bit | 128 Bit |
Memory clock speed | 1334 MHz | 500 MHz |
Memory type | DDR3 | DDR |