AMD Radeon R5 235X OEM vs NVIDIA GeForce Go 6600

Comparative analysis of AMD Radeon R5 235X OEM and NVIDIA GeForce Go 6600 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark.

 

Differences

Reasons to consider the AMD Radeon R5 235X OEM

  • Videocard is newer: launch date 8 year(s) 2 month(s) later
  • 2.9x more core clock speed: 875 MHz vs 300 MHz
  • 2.9x more texture fill rate: 7 GTexel / s vs 2.4 GTexel / s
  • 20x more pipelines: 160 vs 8
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 110 nm
  • 4x more maximum memory size: 1 GB vs 256 MB
  • 2.6x more memory clock speed: 1800 MHz vs 700 MHz
  • 4x better performance in PassMark - G3D Mark: 277 vs 69
Specifications (specs)
Launch date 21 December 2013 vs 29 September 2005
Core clock speed 875 MHz vs 300 MHz
Texture fill rate 7 GTexel / s vs 2.4 GTexel / s
Pipelines 160 vs 8
Manufacturing process technology 40 nm vs 110 nm
Maximum memory size 1 GB vs 256 MB
Memory clock speed 1800 MHz vs 700 MHz
Benchmarks
PassMark - G3D Mark 277 vs 69

Reasons to consider the NVIDIA GeForce Go 6600

  • Around 3% better performance in PassMark - G2D Mark: 209 vs 202
Benchmarks
PassMark - G2D Mark 209 vs 202

Compare benchmarks

GPU 1: AMD Radeon R5 235X OEM
GPU 2: NVIDIA GeForce Go 6600

PassMark - G2D Mark
GPU 1
GPU 2
202
209
PassMark - G3D Mark
GPU 1
GPU 2
277
69
Name AMD Radeon R5 235X OEM NVIDIA GeForce Go 6600
PassMark - G2D Mark 202 209
PassMark - G3D Mark 277 69

Compare specifications (specs)

AMD Radeon R5 235X OEM NVIDIA GeForce Go 6600

Essentials

Architecture TeraScale 2 Curie
Code name Caicos NV43 A2
Launch date 21 December 2013 29 September 2005
Place in performance rating 834 837
Type Desktop Laptop

Technical info

Core clock speed 875 MHz 300 MHz
Floating-point performance 280.0 gflops
Manufacturing process technology 40 nm 110 nm
Pipelines 160 8
Texture fill rate 7 GTexel / s 2.4 GTexel / s
Thermal Design Power (TDP) 18 Watt
Transistor count 370 million 146 million
Boost clock speed 375 MHz

Video outputs and ports

Display Connectors 1x DVI, 1x HDMI No outputs

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16 MXM-II
Length 168 mm
Supplementary power connectors None
Laptop size medium sized

API support

DirectX 11.2 (11_0) 9.0c
OpenGL 4.4 2.1

Memory

Maximum RAM amount 1 GB 256 MB
Memory bandwidth 14.4 GB / s 11.2 GB / s
Memory bus width 64 Bit 300 Bit
Memory clock speed 1800 MHz 700 MHz
Memory type DDR3 128
Shared memory 0