AMD Radeon R5 330 OEM vs ATI Radeon 9700 PRO

Comparative analysis of AMD Radeon R5 330 OEM and ATI Radeon 9700 PRO videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.

 

Differences

Reasons to consider the AMD Radeon R5 330 OEM

  • Videocard is newer: launch date 12 year(s) 10 month(s) later
  • 2.6x more core clock speed: 830 MHz vs 325 MHz
  • 6.6x more texture fill rate: 17.1 GTexel / s vs 2.6 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 150 nm
  • 16x more maximum memory size: 2 GB vs 128 MB
  • 2.9x more memory clock speed: 1800 MHz vs 620 MHz
  • Around 23% better performance in PassMark - G2D Mark: 184 vs 149
  • 9.6x better performance in PassMark - G3D Mark: 521 vs 54
Specifications (specs)
Launch date 5 May 2015 vs 1 July 2002
Core clock speed 830 MHz vs 325 MHz
Texture fill rate 17.1 GTexel / s vs 2.6 GTexel / s
Manufacturing process technology 28 nm vs 150 nm
Maximum memory size 2 GB vs 128 MB
Memory clock speed 1800 MHz vs 620 MHz
Benchmarks
PassMark - G2D Mark 184 vs 149
PassMark - G3D Mark 521 vs 54

Compare benchmarks

GPU 1: AMD Radeon R5 330 OEM
GPU 2: ATI Radeon 9700 PRO

PassMark - G2D Mark
GPU 1
GPU 2
184
149
PassMark - G3D Mark
GPU 1
GPU 2
521
54
Name AMD Radeon R5 330 OEM ATI Radeon 9700 PRO
PassMark - G2D Mark 184 149
PassMark - G3D Mark 521 54
Geekbench - OpenCL 5123

Compare specifications (specs)

AMD Radeon R5 330 OEM ATI Radeon 9700 PRO

Essentials

Architecture GCN 1.0 Rage 8
Code name Hainan R300
Launch date 5 May 2015 1 July 2002
Place in performance rating 1105 1102
Type Desktop Desktop

Technical info

Boost clock speed 855 MHz
Core clock speed 830 MHz 325 MHz
Floating-point performance 547.2 gflops
Manufacturing process technology 28 nm 150 nm
Pipelines 320
Texture fill rate 17.1 GTexel / s 2.6 GTexel / s
Thermal Design Power (TDP) 50 Watt
Transistor count 1,040 million 110 million

Video outputs and ports

Display Connectors No outputs 1x DVI, 1x VGA, 1x S-Video

Compatibility, dimensions and requirements

Interface PCIe 3.0 x8 AGP 8x
Supplementary power connectors None Floppy

API support

DirectX 12.0 (11_1) 9.0
OpenGL 4.5 2.0

Memory

Maximum RAM amount 2 GB 128 MB
Memory bandwidth 28.8 GB / s 19.84 GB / s
Memory bus width 128 Bit 256 Bit
Memory clock speed 1800 MHz 620 MHz
Memory type DDR3 DDR