AMD Radeon R5 330 OEM vs NVIDIA GeForce2 Ti

Comparative analysis of AMD Radeon R5 330 OEM and NVIDIA GeForce2 Ti videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.

AMD Radeon R5 330 OEM

NVIDIA GeForce2 Ti

Differences

Reasons to consider the AMD Radeon R5 330 OEM

Videocard is newer: launch date 13 year(s) 7 month(s) later
3.3x more core clock speed: 830 MHz vs 250 MHz
8.6x more texture fill rate: 17.1 GTexel / s vs 2 GTexel / s
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 150 nm
32x more maximum memory size: 2 GB vs 64 MB
4.5x more memory clock speed: 1800 MHz vs 400 MHz
Around 23% better performance in PassMark - G2D Mark: 184 vs 149
104.2x better performance in PassMark - G3D Mark: 521 vs 5

Specifications (specs)
Launch date	5 May 2015 vs 1 October 2001
Core clock speed	830 MHz vs 250 MHz
Texture fill rate	17.1 GTexel / s vs 2 GTexel / s
Manufacturing process technology	28 nm vs 150 nm
Maximum memory size	2 GB vs 64 MB
Memory clock speed	1800 MHz vs 400 MHz
Benchmarks
PassMark - G2D Mark	184 vs 149
PassMark - G3D Mark	521 vs 5

Compare benchmarks

GPU 1: AMD Radeon R5 330 OEM
GPU 2: NVIDIA GeForce2 Ti

PassMark - G2D Mark

GPU 1

GPU 2

184

149

PassMark - G3D Mark

GPU 1

GPU 2

521

Name	AMD Radeon R5 330 OEM	NVIDIA GeForce2 Ti
PassMark - G2D Mark	184	149
PassMark - G3D Mark	521	5
Geekbench - OpenCL	5123

Compare specifications (specs)

	AMD Radeon R5 330 OEM	NVIDIA GeForce2 Ti
Essentials
Architecture	GCN 1.0	Celsius
Code name	Hainan	NV15 A5
Launch date	5 May 2015	1 October 2001
Place in performance rating	1106	1103
Type	Desktop	Desktop
Technical info
Boost clock speed	855 MHz
Core clock speed	830 MHz	250 MHz
Floating-point performance	547.2 gflops
Manufacturing process technology	28 nm	150 nm
Pipelines	320
Texture fill rate	17.1 GTexel / s	2 GTexel / s
Thermal Design Power (TDP)	50 Watt
Transistor count	1,040 million	25 million
Video outputs and ports
Display Connectors	No outputs	1x VGA, 2x S-Video
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x8	AGP 4x
Supplementary power connectors	None	None
Length		165 mm
API support
DirectX	12.0 (11_1)	7.0
OpenGL	4.5	1.2
Memory
Maximum RAM amount	2 GB	64 MB
Memory bandwidth	28.8 GB / s	6.4 GB / s
Memory bus width	128 Bit	128 Bit
Memory clock speed	1800 MHz	400 MHz
Memory type	DDR3	DDR