AMD Radeon RX Vega 11 Mobile vs ATI Mobility FireGL 7800

Comparative analysis of AMD Radeon RX Vega 11 Mobile and ATI Mobility FireGL 7800 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: 3DMark Fire Strike - Graphics Score, PassMark - G2D Mark, PassMark - G3D Mark.

AMD Radeon RX Vega 11 Mobile

ATI Mobility FireGL 7800

Differences

Reasons to consider the AMD Radeon RX Vega 11 Mobile

Videocard is newer: launch date 16 year(s) 7 month(s) later
Around 7% higher core clock speed: 300 MHz vs 280 MHz
4.5x more boost clock speed: 1250 MHz vs 280 MHz
352x more pipelines: 704 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 14 nm vs 150 nm
4x more maximum memory size: 256 MB vs 64 MB

Launch date	15 May 2018 vs 29 September 2001
Core clock speed	300 MHz vs 280 MHz
Boost clock speed	1250 MHz vs 280 MHz
Pipelines	704 vs 2
Manufacturing process technology	14 nm vs 150 nm
Maximum memory size	256 MB vs 64 MB

Reasons to consider the ATI Mobility FireGL 7800

9.8x more texture fill rate: 560 MTexel / s vs 57.2 GTexel / s
Around 30% lower typical power consumption: 27 Watt vs 35 Watt

Texture fill rate	560 MTexel / s vs 57.2 GTexel / s
Thermal Design Power (TDP)	27 Watt vs 35 Watt

Compare benchmarks

GPU 1: AMD Radeon RX Vega 11 Mobile
GPU 2: ATI Mobility FireGL 7800

Name	AMD Radeon RX Vega 11 Mobile	ATI Mobility FireGL 7800
3DMark Fire Strike - Graphics Score	1162
PassMark - G2D Mark		86
PassMark - G3D Mark		5

Compare specifications (specs)

	AMD Radeon RX Vega 11 Mobile	ATI Mobility FireGL 7800
Essentials
Architecture	GCN 5.0	Rage 7
Code name	Raven	M7
Launch date	15 May 2018	29 September 2001
Place in performance rating	1457	1455
Type	Desktop	Mobile workstation
Technical info
Boost clock speed	1250 MHz	280 MHz
Core clock speed	300 MHz	280 MHz
Floating-point performance	1,830 gflops
Manufacturing process technology	14 nm	150 nm
Pipelines	704	2
Texture fill rate	57.2 GTexel / s	560 MTexel / s
Thermal Design Power (TDP)	35 Watt	27 Watt
Transistor count	4,940 million	60 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	IGP	AGP 4x
Laptop size		medium sized
API support
DirectX	12.0 (12_1)	7.0
OpenGL	4.6	1.3
Memory
Maximum RAM amount	256 MB	64 MB
Memory bandwidth	12.8 GB / s	6.4 GB / s
Memory bus width	128 Bit	200 Bit
Memory type	DDR4	64 / 128
Memory clock speed		400 MHz
Shared memory		0