AMD Radeon RX Vega 11 Mobile vs Intel HD Graphics 6000

Comparative analysis of AMD Radeon RX Vega 11 Mobile and Intel HD Graphics 6000 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: 3DMark Fire Strike - Graphics Score, PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the AMD Radeon RX Vega 11 Mobile

  • Videocard is newer: launch date 3 year(s) 8 month(s) later
  • Around 25% higher boost clock speed: 1250 MHz vs 1000 MHz
  • 14.7x more pipelines: 704 vs 48
Launch date 15 May 2018 vs 5 September 2014
Boost clock speed 1250 MHz vs 1000 MHz
Pipelines 704 vs 48

Reasons to consider the Intel HD Graphics 6000

  • 2.3x lower typical power consumption: 15 Watt vs 35 Watt
Thermal Design Power (TDP) 15 Watt vs 35 Watt

Compare benchmarks

GPU 1: AMD Radeon RX Vega 11 Mobile
GPU 2: Intel HD Graphics 6000

Name AMD Radeon RX Vega 11 Mobile Intel HD Graphics 6000
3DMark Fire Strike - Graphics Score 1137
PassMark - G3D Mark 875
PassMark - G2D Mark 273
Geekbench - OpenCL 3519
GFXBench 4.0 - Car Chase Offscreen (Frames) 1225
GFXBench 4.0 - Car Chase Offscreen (Fps) 1225
GFXBench 4.0 - Manhattan (Frames) 1363
GFXBench 4.0 - Manhattan (Fps) 1363
GFXBench 4.0 - T-Rex (Frames) 3259
GFXBench 4.0 - T-Rex (Fps) 3259

Compare specifications (specs)

AMD Radeon RX Vega 11 Mobile Intel HD Graphics 6000

Essentials

Architecture GCN 5.0 Generation 8.0
Code name Raven Broadwell GT3
Launch date 15 May 2018 5 September 2014
Place in performance rating 1123 1126
Type Desktop Laptop

Technical info

Boost clock speed 1250 MHz 1000 MHz
Core clock speed 300 MHz 300 MHz
Floating-point performance 1,830 gflops
Manufacturing process technology 14 nm 14 nm
Pipelines 704 48
Texture fill rate 57.2 GTexel / s
Thermal Design Power (TDP) 35 Watt 15 Watt
Transistor count 4,940 million 189 million

Video outputs and ports

Display Connectors No outputs No outputs

Compatibility, dimensions and requirements

Interface IGP PCIe 2.0 x1

API support

DirectX 12.0 (12_1) 12.0 (11_1)
OpenGL 4.6 4.6

Memory

Maximum RAM amount 256 MB
Memory bandwidth 12.8 GB / s
Memory bus width 128 Bit 64 / 128 Bit
Memory type DDR4
Shared memory 1

Technologies

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