ATI Mobility Radeon HD 3430 vs NVIDIA Tesla S870

Comparative analysis of ATI Mobility Radeon HD 3430 and NVIDIA Tesla S870 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

ATI Mobility Radeon HD 3430

NVIDIA Tesla S870

Differences

Reasons to consider the ATI Mobility Radeon HD 3430

Videocard is newer: launch date 1 year(s) 2 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 90 nm
66.7x lower typical power consumption: 12 Watt vs 800 Watt

Launch date	25 July 2008 vs 2 May 2007
Manufacturing process technology	55 nm vs 90 nm
Thermal Design Power (TDP)	12 Watt vs 800 Watt

Reasons to consider the NVIDIA Tesla S870

Around 33% higher core clock speed: 600 MHz vs 450 MHz
232.9x more texture fill rate: 4x 19.2 GTexel / s billion / sec vs 1.8 GTexel / s
12.8x more pipelines: 4x 128 vs 40
38.4x better floating-point performance: 4x 345.6 gflops vs 36 gflops
24x more maximum memory size: 4x 1536 MB vs 256 MB
2x more memory clock speed: 1600 MHz vs 800 MHz

Core clock speed	600 MHz vs 450 MHz
Texture fill rate	4x 19.2 GTexel / s billion / sec vs 1.8 GTexel / s
Pipelines	4x 128 vs 40
Floating-point performance	4x 345.6 gflops vs 36 gflops
Maximum memory size	4x 1536 MB vs 256 MB
Memory clock speed	1600 MHz vs 800 MHz

Compare benchmarks

GPU 1: ATI Mobility Radeon HD 3430
GPU 2: NVIDIA Tesla S870

Name	ATI Mobility Radeon HD 3430	NVIDIA Tesla S870
PassMark - G3D Mark	98
PassMark - G2D Mark	260

Compare specifications (specs)

	ATI Mobility Radeon HD 3430	NVIDIA Tesla S870
Essentials
Architecture	TeraScale	Tesla
Code name	M82	G80
Launch date	25 July 2008	2 May 2007
Place in performance rating	687	not rated
Type	Laptop	Workstation
Launch price (MSRP)		$11,999
Technical info
Core clock speed	450 MHz	600 MHz
Floating-point performance	36 gflops	4x 345.6 gflops
Manufacturing process technology	55 nm	90 nm
Pipelines	40	4x 128
Texture fill rate	1.8 GTexel / s	4x 19.2 GTexel / s billion / sec
Thermal Design Power (TDP)	12 Watt	800 Watt
Transistor count	181 million	681 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	MXM-II	PCIe 1.0 x16
API support
DirectX	10.1	10.0
OpenGL	3.3	3.3
Memory
Maximum RAM amount	256 MB	4x 1536 MB
Memory bandwidth	6.4 GB / s	4x 76.8 GB / s
Memory bus width	64 Bit	4x 384 Bit
Memory clock speed	800 MHz	1600 MHz
Memory type	GDDR2	GDDR3
Shared memory	0