ATI Mobility Radeon HD 540v vs ATI Radeon X1650 GTO

Comparative analysis of ATI Mobility Radeon HD 540v and ATI Radeon X1650 GTO videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the ATI Mobility Radeon HD 540v

  • Videocard is newer: launch date 2 year(s) 5 month(s) later
  • Around 87% higher texture fill rate: 4.4 GTexel / s vs 2.348 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 90 nm
  • 2x more maximum memory size: 512 MB vs 256 MB
  • 2x more memory clock speed: 1600 MHz vs 784 MHz
  • 2.5x better performance in PassMark - G3D Mark: 188 vs 75
Specifications (specs)
Launch date 5 May 2010 vs 2 December 2007
Texture fill rate 4.4 GTexel / s vs 2.348 GTexel / s
Manufacturing process technology 55 nm vs 90 nm
Maximum memory size 512 MB vs 256 MB
Memory clock speed 1600 MHz vs 784 MHz
Benchmarks
PassMark - G3D Mark 188 vs 75

Reasons to consider the ATI Radeon X1650 GTO

  • Around 7% higher core clock speed: 587 MHz vs 550 MHz
  • Around 1% better performance in PassMark - G2D Mark: 384 vs 382
Specifications (specs)
Core clock speed 587 MHz vs 550 MHz
Benchmarks
PassMark - G2D Mark 384 vs 382

Compare benchmarks

GPU 1: ATI Mobility Radeon HD 540v
GPU 2: ATI Radeon X1650 GTO

PassMark - G3D Mark
GPU 1
GPU 2
188
75
PassMark - G2D Mark
GPU 1
GPU 2
382
384
Name ATI Mobility Radeon HD 540v ATI Radeon X1650 GTO
PassMark - G3D Mark 188 75
PassMark - G2D Mark 382 384

Compare specifications (specs)

ATI Mobility Radeon HD 540v ATI Radeon X1650 GTO

Essentials

Architecture TeraScale R500
Code name M92 RV530
Launch date 5 May 2010 2 December 2007
Place in performance rating 415 417
Type Laptop Desktop

Technical info

Core clock speed 550 MHz 587 MHz
Floating-point performance 88 gflops
Manufacturing process technology 55 nm 90 nm
Pipelines 80
Texture fill rate 4.4 GTexel / s 2.348 GTexel / s
Thermal Design Power (TDP) 15 Watt
Transistor count 242 million 157 million

Video outputs and ports

Display Connectors No outputs 1x HDMI, 1x VGA

Compatibility, dimensions and requirements

Interface MXM-A (3.0) PCIe 1.0 x16
Supplementary power connectors None

API support

DirectX 10.1 9.0c
OpenGL 3.3 2.0

Memory

Maximum RAM amount 512 MB 256 MB
Memory bandwidth 12.8 GB / s 12.54 GB / s
Memory bus width 64 Bit 128 Bit
Memory clock speed 1600 MHz 784 MHz
Memory type GDDR3, DDR3, DDR2 DDR2
Shared memory 0