ATI Mobility Radeon HD 540v vs ATI Radeon X1650 GTO

Comparative analysis of ATI Mobility Radeon HD 540v and ATI Radeon X1650 GTO videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

ATI Mobility Radeon HD 540v

ATI Radeon X1650 GTO

Differences

Reasons to consider the ATI Mobility Radeon HD 540v

Videocard is newer: launch date 2 year(s) 5 month(s) later
Around 87% higher texture fill rate: 4.4 GTexel / s vs 2.348 GTexel / s
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 90 nm
2x more maximum memory size: 512 MB vs 256 MB
2x more memory clock speed: 1600 MHz vs 784 MHz
2.5x better performance in PassMark - G3D Mark: 188 vs 75

Specifications (specs)
Launch date	5 May 2010 vs 2 December 2007
Texture fill rate	4.4 GTexel / s vs 2.348 GTexel / s
Manufacturing process technology	55 nm vs 90 nm
Maximum memory size	512 MB vs 256 MB
Memory clock speed	1600 MHz vs 784 MHz
Benchmarks
PassMark - G3D Mark	188 vs 75

Reasons to consider the ATI Radeon X1650 GTO

Around 7% higher core clock speed: 587 MHz vs 550 MHz
Around 1% better performance in PassMark - G2D Mark: 384 vs 382

Specifications (specs)
Core clock speed	587 MHz vs 550 MHz
Benchmarks
PassMark - G2D Mark	384 vs 382

Compare benchmarks

GPU 1: ATI Mobility Radeon HD 540v
GPU 2: ATI Radeon X1650 GTO

PassMark - G3D Mark

GPU 1

GPU 2

188

PassMark - G2D Mark

GPU 1

GPU 2

382

384

Name	ATI Mobility Radeon HD 540v	ATI Radeon X1650 GTO
PassMark - G3D Mark	188	75
PassMark - G2D Mark	382	384

Compare specifications (specs)

	ATI Mobility Radeon HD 540v	ATI Radeon X1650 GTO
Essentials
Architecture	TeraScale	R500
Code name	M92	RV530
Launch date	5 May 2010	2 December 2007
Place in performance rating	410	413
Type	Laptop	Desktop
Technical info
Core clock speed	550 MHz	587 MHz
Floating-point performance	88 gflops
Manufacturing process technology	55 nm	90 nm
Pipelines	80
Texture fill rate	4.4 GTexel / s	2.348 GTexel / s
Thermal Design Power (TDP)	15 Watt
Transistor count	242 million	157 million
Video outputs and ports
Display Connectors	No outputs	1x HDMI, 1x VGA
Compatibility, dimensions and requirements
Interface	MXM-A (3.0)	PCIe 1.0 x16
Supplementary power connectors		None
API support
DirectX	10.1	9.0c
OpenGL	3.3	2.0
Memory
Maximum RAM amount	512 MB	256 MB
Memory bandwidth	12.8 GB / s	12.54 GB / s
Memory bus width	64 Bit	128 Bit
Memory clock speed	1600 MHz	784 MHz
Memory type	GDDR3, DDR3, DDR2	DDR2
Shared memory	0