Intel UHD Graphics G1 (Ice Lake 32 EU) vs NVIDIA GeForce Go 7200

Comparative analysis of Intel UHD Graphics G1 (Ice Lake 32 EU) and NVIDIA GeForce Go 7200 videocards for all known characteristics in the following categories: Essentials, Technical info, API support, Memory, Technologies, Video outputs and ports, Compatibility, dimensions and requirements. Benchmark videocards performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the Intel UHD Graphics G1 (Ice Lake 32 EU)

  • Videocard is newer: launch date 12 year(s) 8 month(s) later
  • 2.4x more boost clock speed: 1100 MHz vs 450 MHz
  • 8x more pipelines: 32 vs 4
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 10 nm vs 90 nm
Launch date 28 May 2019 vs 1 September 2006
Boost clock speed 1100 MHz vs 450 MHz
Pipelines 32 vs 4
Manufacturing process technology 10 nm vs 90 nm

Reasons to consider the NVIDIA GeForce Go 7200

  • Around 50% higher core clock speed: 450 MHz vs 300 MHz
Core clock speed 450 MHz vs 300 MHz

Compare benchmarks

GPU 1: Intel UHD Graphics G1 (Ice Lake 32 EU)
GPU 2: NVIDIA GeForce Go 7200

Name Intel UHD Graphics G1 (Ice Lake 32 EU) NVIDIA GeForce Go 7200
GFXBench 4.0 - Car Chase Offscreen (Frames) 1887
GFXBench 4.0 - Car Chase Offscreen (Fps) 1887
GFXBench 4.0 - Manhattan (Frames) 3505
GFXBench 4.0 - Manhattan (Fps) 3505
GFXBench 4.0 - T-Rex (Frames) 3352
GFXBench 4.0 - T-Rex (Fps) 3352
PassMark - G3D Mark 45
PassMark - G2D Mark 199

Compare specifications (specs)

Intel UHD Graphics G1 (Ice Lake 32 EU) NVIDIA GeForce Go 7200

Essentials

Architecture Intel Gen. 11 (Ice Lake) Curie
Code name Ice Lake G1 Gen. 11 G72
Launch date 28 May 2019 1 September 2006
Place in performance rating 893 890
Type Laptop Laptop

Technical info

Boost clock speed 1100 MHz 450 MHz
Core clock speed 300 MHz 450 MHz
Manufacturing process technology 10 nm 90 nm
Pipelines 32 4
Thermal Design Power (TDP) 25 Watt
Texture fill rate 1.8 GTexel / s
Transistor count 112 million

API support

DirectX 12.1 9.0c
OpenGL 2.1

Memory

Memory type DDR4 32
Shared memory Yes 0
Maximum RAM amount 64 MB
Memory bandwidth 2.8 GB / s
Memory bus width 350 Bit
Memory clock speed 700 MHz

Technologies

Quick Sync

Video outputs and ports

Display Connectors No outputs

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16