NVIDIA GeForce 210 PCI vs NVIDIA GeForce GT 230

Comparative analysis of NVIDIA GeForce 210 PCI and NVIDIA GeForce GT 230 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), Geekbench - OpenCL.

NVIDIA GeForce 210 PCI

NVIDIA GeForce GT 230

Differences

Reasons to consider the NVIDIA GeForce 210 PCI

A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 55 nm
2.4x lower typical power consumption: 31 Watt vs 75 Watt

Manufacturing process technology	40 nm vs 55 nm
Thermal Design Power (TDP)	31 Watt vs 75 Watt

Reasons to consider the NVIDIA GeForce GT 230

Around 37% higher core clock speed: 650 MHz vs 475 MHz
4.1x more texture fill rate: 15.6 GTexel / s vs 3.8 GTexel / s
3x more pipelines: 48 vs 16
4.4x better floating-point performance: 156 gflops vs 35.2 gflops
2.3x more memory clock speed: 1800 MHz vs 800 MHz

Core clock speed	650 MHz vs 475 MHz
Texture fill rate	15.6 GTexel / s vs 3.8 GTexel / s
Pipelines	48 vs 16
Floating-point performance	156 gflops vs 35.2 gflops
Memory clock speed	1800 MHz vs 800 MHz

Compare benchmarks

GPU 1: NVIDIA GeForce 210 PCI
GPU 2: NVIDIA GeForce GT 230

Name	NVIDIA GeForce 210 PCI	NVIDIA GeForce GT 230
PassMark - G3D Mark		323
PassMark - G2D Mark		70
GFXBench 4.0 - T-Rex (Frames)		3233
GFXBench 4.0 - T-Rex (Fps)		3233
Geekbench - OpenCL		6073

Compare specifications (specs)

	NVIDIA GeForce 210 PCI	NVIDIA GeForce GT 230
Essentials
Architecture	Tesla 2.0	Tesla
Code name	GT216	G94B
Launch date	12 October 2009	12 October 2009
Place in performance rating	not rated	1421
Type	Desktop	Desktop
Launch price (MSRP)		$43.99
Price now		$43.99
Value for money (0-100)		13.94
Technical info
Core clock speed	475 MHz	650 MHz
Floating-point performance	35.2 gflops	156 gflops
Manufacturing process technology	40 nm	55 nm
Pipelines	16	48
Texture fill rate	3.8 GTexel / s	15.6 GTexel / s
Thermal Design Power (TDP)	31 Watt	75 Watt
Transistor count	486 million	505 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCI	PCIe 2.0 x16
Length	145 mm
Supplementary power connectors	None	None
API support
DirectX	10.1	10.0
OpenGL	3.3	3.3
Memory
Maximum RAM amount	512 MB	512 MB
Memory bandwidth	6.4 GB / s	57.6 GB / s
Memory bus width	64 Bit	256 Bit
Memory clock speed	800 MHz	1800 MHz
Memory type	DDR2	GDDR3