NVIDIA GeForce Go 7900 GS vs NVIDIA GeForce FX 5700 LE

Comparative analysis of NVIDIA GeForce Go 7900 GS and NVIDIA GeForce FX 5700 LE videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the NVIDIA GeForce Go 7900 GS

  • Videocard is newer: launch date 2 year(s) 1 month(s) later
  • Around 50% higher core clock speed: 375 MHz vs 250 MHz
  • 7.5x more texture fill rate: 7.5 GTexel / s vs 1 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 90 nm vs 130 nm
  • 4x more maximum memory size: 512 MB vs 128 MB
  • 2.5x more memory clock speed: 1000 MHz vs 400 MHz
  • 7x better performance in PassMark - G3D Mark: 176 vs 25
  • Around 73% better performance in PassMark - G2D Mark: 254 vs 147
Specifications (specs)
Launch date 18 April 2006 vs 1 March 2004
Core clock speed 375 MHz vs 250 MHz
Texture fill rate 7.5 GTexel / s vs 1 GTexel / s
Manufacturing process technology 90 nm vs 130 nm
Maximum memory size 512 MB vs 128 MB
Memory clock speed 1000 MHz vs 400 MHz
Benchmarks
PassMark - G3D Mark 176 vs 25
PassMark - G2D Mark 254 vs 147

Compare benchmarks

GPU 1: NVIDIA GeForce Go 7900 GS
GPU 2: NVIDIA GeForce FX 5700 LE

PassMark - G3D Mark
GPU 1
GPU 2
176
25
PassMark - G2D Mark
GPU 1
GPU 2
254
147
Name NVIDIA GeForce Go 7900 GS NVIDIA GeForce FX 5700 LE
PassMark - G3D Mark 176 25
PassMark - G2D Mark 254 147
GFXBench 4.0 - T-Rex (Frames) 916
GFXBench 4.0 - T-Rex (Fps) 916

Compare specifications (specs)

NVIDIA GeForce Go 7900 GS NVIDIA GeForce FX 5700 LE

Essentials

Architecture Curie Rankine
Code name G71 NV36 A1
Launch date 18 April 2006 1 March 2004
Place in performance rating 1112 1114
Type Laptop Desktop

Technical info

Boost clock speed 375 MHz
Core clock speed 375 MHz 250 MHz
Manufacturing process technology 90 nm 130 nm
Pipelines 20
Texture fill rate 7.5 GTexel / s 1 GTexel / s
Thermal Design Power (TDP) 20 Watt
Transistor count 278 million 82 million

Video outputs and ports

Display Connectors No outputs 1x DVI, 1x VGA, 1x S-Video

Compatibility, dimensions and requirements

Interface MXM-II AGP 8x
Laptop size large

API support

DirectX 9.0c 9.0a
OpenGL 2.1 1.5 (2.1)

Memory

Maximum RAM amount 512 MB 128 MB
Memory bandwidth 32.0 GB / s 3.2 GB / s
Memory bus width 500 Bit 64 Bit
Memory clock speed 1000 MHz 400 MHz
Memory type 256 DDR
Shared memory 0