NVIDIA Tesla D870 vs NVIDIA GeForce 8600M GS

Comparative analysis of NVIDIA Tesla D870 and NVIDIA GeForce 8600M GS videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the NVIDIA Tesla D870

  • Around 33% higher core clock speed: 600 MHz vs 450 MHz
  • 60.9x more texture fill rate: 2x 19.2 GTexel / s billion / sec vs 3.6 GTexel / s
  • 16x more pipelines: 2x 128 vs 16
  • 24x better floating-point performance: 2x 345.6 gflops vs 28.8 gflops
  • 6x more maximum memory size: 2x 1536 MB vs 512 MB
  • 2x more memory clock speed: 1600 MHz vs 800 MHz
Core clock speed 600 MHz vs 450 MHz
Texture fill rate 2x 19.2 GTexel / s billion / sec vs 3.6 GTexel / s
Pipelines 2x 128 vs 16
Floating-point performance 2x 345.6 gflops vs 28.8 gflops
Maximum memory size 2x 1536 MB vs 512 MB
Memory clock speed 1600 MHz vs 800 MHz

Reasons to consider the NVIDIA GeForce 8600M GS

  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 80 nm vs 90 nm
  • 26x lower typical power consumption: 20 Watt vs 520 Watt
Manufacturing process technology 80 nm vs 90 nm
Thermal Design Power (TDP) 20 Watt vs 520 Watt

Compare benchmarks

GPU 1: NVIDIA Tesla D870
GPU 2: NVIDIA GeForce 8600M GS

Name NVIDIA Tesla D870 NVIDIA GeForce 8600M GS
PassMark - G3D Mark 70
PassMark - G2D Mark 35
GFXBench 4.0 - T-Rex (Frames) 1095
GFXBench 4.0 - T-Rex (Fps) 1095

Compare specifications (specs)

NVIDIA Tesla D870 NVIDIA GeForce 8600M GS

Essentials

Architecture Tesla Tesla
Code name G80 G86
Launch date 2 May 2007 1 May 2007
Launch price (MSRP) $7,499
Place in performance rating not rated 1650
Type Workstation Laptop

Technical info

Core clock speed 600 MHz 450 MHz
Floating-point performance 2x 345.6 gflops 28.8 gflops
Manufacturing process technology 90 nm 80 nm
Pipelines 2x 128 16
Texture fill rate 2x 19.2 GTexel / s billion / sec 3.6 GTexel / s
Thermal Design Power (TDP) 520 Watt 20 Watt
Transistor count 681 million 210 million

Video outputs and ports

Display Connectors No outputs No outputs

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16 MXM-II
Laptop size medium sized

API support

DirectX 10.0 10.0
OpenGL 3.3 3.3

Memory

Maximum RAM amount 2x 1536 MB 512 MB
Memory bandwidth 2x 76.8 GB / s 12.8 GB / s
Memory bus width 2x 384 Bit 128 Bit
Memory clock speed 1600 MHz 800 MHz
Memory type GDDR3 GDDR3, GDDR2
Shared memory 0

Technologies

HDR (High Dynamic-Range Lighting)
PCI-E 16x
PowerMizer 7.0

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