NVIDIA Tesla S870 vs NVIDIA GeForce 8600M GS

Comparative analysis of NVIDIA Tesla S870 and NVIDIA GeForce 8600M GS videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

NVIDIA Tesla S870

NVIDIA GeForce 8600M GS

Differences

Reasons to consider the NVIDIA Tesla S870

Around 33% higher core clock speed: 600 MHz vs 450 MHz
116.4x more texture fill rate: 4x 19.2 GTexel / s billion / sec vs 3.6 GTexel / s
32x more pipelines: 4x 128 vs 16
48x better floating-point performance: 4x 345.6 gflops vs 28.8 gflops
12x more maximum memory size: 4x 1536 MB vs 512 MB
2x more memory clock speed: 1600 MHz vs 800 MHz

Core clock speed	600 MHz vs 450 MHz
Texture fill rate	4x 19.2 GTexel / s billion / sec vs 3.6 GTexel / s
Pipelines	4x 128 vs 16
Floating-point performance	4x 345.6 gflops vs 28.8 gflops
Maximum memory size	4x 1536 MB vs 512 MB
Memory clock speed	1600 MHz vs 800 MHz

Reasons to consider the NVIDIA GeForce 8600M GS

A newer manufacturing process allows for a more powerful, yet cooler running videocard: 80 nm vs 90 nm
40x lower typical power consumption: 20 Watt vs 800 Watt

Manufacturing process technology	80 nm vs 90 nm
Thermal Design Power (TDP)	20 Watt vs 800 Watt

Compare benchmarks

GPU 1: NVIDIA Tesla S870
GPU 2: NVIDIA GeForce 8600M GS

Name	NVIDIA Tesla S870	NVIDIA GeForce 8600M GS
PassMark - G3D Mark		70
PassMark - G2D Mark		35
GFXBench 4.0 - T-Rex (Frames)		1095
GFXBench 4.0 - T-Rex (Fps)		1095

Compare specifications (specs)

	NVIDIA Tesla S870	NVIDIA GeForce 8600M GS
Essentials
Architecture	Tesla	Tesla
Code name	G80	G86
Launch date	2 May 2007	1 May 2007
Launch price (MSRP)	$11,999
Place in performance rating	not rated	1650
Type	Workstation	Laptop
Technical info
Core clock speed	600 MHz	450 MHz
Floating-point performance	4x 345.6 gflops	28.8 gflops
Manufacturing process technology	90 nm	80 nm
Pipelines	4x 128	16
Texture fill rate	4x 19.2 GTexel / s billion / sec	3.6 GTexel / s
Thermal Design Power (TDP)	800 Watt	20 Watt
Transistor count	681 million	210 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 1.0 x16	MXM-II
Laptop size		medium sized
API support
DirectX	10.0	10.0
OpenGL	3.3	3.3
Memory
Maximum RAM amount	4x 1536 MB	512 MB
Memory bandwidth	4x 76.8 GB / s	12.8 GB / s
Memory bus width	4x 384 Bit	128 Bit
Memory clock speed	1600 MHz	800 MHz
Memory type	GDDR3	GDDR3, GDDR2
Shared memory		0
Technologies
HDR (High Dynamic-Range Lighting)
PCI-E 16x
PowerMizer 7.0