| Nom de code de l’architecture |
Haswell |
Ivy Bridge |
| Date de sortie |
December 2013 |
August 2012 |
| Position dans l’évaluation de la performance |
2659 |
2661 |
| Processor Number |
G1820TE |
i3-3217UE |
| Série |
Intel® Celeron® Processor G Series |
Legacy Intel® Core™ Processors |
| Status |
Launched |
Launched |
| Segment vertical |
Embedded |
Embedded |
| Soutien de 64-bit |
|
|
| Base frequency |
2.20 GHz |
1.60 GHz |
| Bus Speed |
5 GT/s DMI2 |
5 GT/s DMI |
| Taille de dé |
177 mm |
118 mm |
| Cache L1 |
64 KB (per core) |
64 KB (per core) |
| Cache L2 |
256 KB (per core) |
256 KB (per core) |
| Cache L3 |
3072 KB (shared) |
3072 KB (shared) |
| Processus de fabrication |
22 nm |
22 nm |
| Température maximale de la caisse (TCase) |
72 °C |
|
| Fréquence maximale |
2.2 GHz |
1.6 GHz |
| Nombre de noyaux |
2 |
2 |
| Nombre de fils |
2 |
4 |
| Compte de transistor |
1400 million |
|
| Température de noyau maximale |
|
105°C |
| Soutien de la mémoire ECC |
|
|
| Réseaux de mémoire maximale |
2 |
2 |
| Bande passante de mémoire maximale |
21.3 GB/s |
25.6 GB/s |
| Taille de mémore maximale |
32 GB |
16 GB |
| Genres de mémoire soutenus |
DDR3 1333 |
DDR3/DDR3L 1333/1600 |
| Graphics base frequency |
350 MHz |
350 MHz |
| Graphics max dynamic frequency |
1.00 GHz |
900 MHz |
| Freéquency maximale des graphiques |
1 GHz |
900 MHz |
| Intel® Flexible Display Interface (Intel® FDI) |
|
|
| Intel® Quick Sync Video |
|
|
| Mémoire de vidéo maximale |
1.7 GB |
|
| Graphiques du processeur |
Intel HD Graphics |
Intel® HD Graphics 4000 |
| Technologie Intel® Clear Video HD |
|
|
| Technologie Intel® Clear Video |
|
|
| Technologie Intel® InTru™ 3D |
|
|
| DisplayPort |
|
|
| DVI |
|
|
| eDP |
|
|
| HDMI |
|
|
| Nombre d’écrans soutenu |
3 |
3 |
| VGA |
|
|
| CRT |
|
|
| SDVO |
|
|
| Soutien du Wireless Display (WiDi) |
|
|
| Low Halogen Options Available |
|
|
| Nombre de CPUs maximale dans une configuration |
1 |
1 |
| Package Size |
37.5mm x 37.5mm |
31mm x 24mm |
| Prise courants soutenu |
FCLGA1150 |
FCBGA1023 |
| Thermal Design Power (TDP) |
35 Watt |
17 Watt |
| Thermal Solution |
PCG 2013A |
|
| Nombre maximale des voies PCIe |
16 |
1 |
| Révision PCI Express |
Up to 3.0 |
2.0 |
| PCIe configurations |
Up to 1x16, 2x8, 1x8/2x4 |
1x16 2x8 1x8 2x4 |
| Scalability |
1S Only |
|
| Execute Disable Bit (EDB) |
|
|
| Technologie Intel® Identity Protection |
|
|
| Technologie Intel® Secure Key |
|
|
| Technologie Intel® Trusted Execution (TXT) |
|
|
| Technologie Anti-Theft |
|
|
| Technologie Enhanced Intel SpeedStep® |
|
|
| Flexible Display interface (FDI) |
|
|
| Idle States |
|
|
| Extensions de l’ensemble d’instructions |
Intel® SSE4.1, Intel® SSE4.2 |
Intel® AVX |
| Intel 64 |
|
|
| Intel® AES New Instructions |
|
|
| Technologie Intel® Hyper-Threading |
|
|
| Intel® Stable Image Platform Program (SIPP) |
|
|
| Intel® TSX-NI |
|
|
| Technologie Intel® Turbo Boost |
|
|
| Intel® vPro™ Platform Eligibility |
|
|
| Thermal Monitoring |
|
|
| 4G WiMAX Wireless |
|
|
| Intel® Advanced Vector Extensions (AVX) |
|
|
| Intel® Demand Based Switching |
|
|
| Intel® Fast Memory Access |
|
|
| Intel® Flex Memory Access |
|
|
| Technologie Intel® My WiFi |
|
|
| Intel® Virtualization Technology (VT-x) |
|
|
| Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
| Intel® VT-x with Extended Page Tables (EPT) |
|
|
Intel
