| Nom de code de l’architecture |
Skylake |
Kaveri |
| Date de sortie |
Q4'15 |
1 June 2014 |
| Position dans l’évaluation de la performance |
2170 |
2163 |
| Numéro du processeur |
i3-6102E |
|
| Série |
6th Generation Intel® Core™ i3 Processors |
AMD A6-Series APU for Laptops |
| Statut |
Launched |
|
| Segment vertical |
Embedded |
Laptop |
| Family |
|
AMD A-Series Processors |
| OPN Tray |
|
AM7000ECH23JA |
| Soutien de 64-bit |
|
|
| Fréquence de base |
1.90 GHz |
2.2 GHz |
| Bus Speed |
8 GT/s DMI3 |
|
| Processus de fabrication |
14 nm |
28 nm |
| Température de noyau maximale |
100°C |
|
| Nombre de noyaux |
2 |
2 |
| Nombre de fils |
4 |
2 |
| Compute Cores |
|
5 |
| Cache L2 |
|
1 MB |
| Fréquence maximale |
|
3 GHz |
| Number of GPU cores |
|
3 |
| Ouvert |
|
|
| Réseaux de mémoire maximale |
2 |
2 |
| Bande passante de mémoire maximale |
34.1 GB/s |
|
| Taille de mémore maximale |
64 GB |
|
| Genres de mémoire soutenus |
DDR4-2133, LPDDR3-1866, DDR3L-1600 |
DDR3U-1333, DDR3L-1600, DDR3-1600 |
| Device ID |
0x191B |
|
| Graphics base frequency |
350 MHz |
|
| Graphics max dynamic frequency |
950 MHz |
|
| Technologie Intel® Clear Video HD |
|
|
| Technologie Intel® Clear Video |
|
|
| Technologie Intel® InTru™ 3D |
|
|
| Intel® Quick Sync Video |
|
|
| Mémoire de vidéo maximale |
64 GB |
|
| Graphiques du processeur |
Intel® HD Graphics 530 |
AMD Radeon R4 Graphics |
| Enduro |
|
|
| Freéquency maximale des graphiques |
|
533 MHz |
| Compte de noyaux iGPU |
|
3 |
| Graphiques changeables |
|
|
| Unified Video Decoder (UVD) |
|
|
| Video Codec Engine (VCE) |
|
|
| DisplayPort |
|
|
| DVI |
|
|
| eDP |
|
|
| HDMI |
|
|
| Nombre d’écrans soutenu |
3 |
|
| Soutien de la resolution 4K |
|
|
| Résolution maximale sur DisplayPort |
4096x2304@60Hz |
|
| Résolution maximale sur eDP |
4096x2304@60Hz |
|
| Résolution maximale sur HDMI 1.4 |
4096x2304@24Hz |
|
| DirectX |
12 |
12 |
| OpenGL |
4.5 |
|
| Vulkan |
|
|
| Low Halogen Options Available |
|
|
| Nombre de CPUs maximale dans une configuration |
1 |
|
| Dimensions du boîtier |
42mm x 28mm |
|
| Prise courants soutenu |
FCBGA1440 |
FT3 |
| Thermal Design Power (TDP) |
25 Watt |
17 Watt |
| Nombre maximale des voies PCIe |
16 |
|
| Révision PCI Express |
3.0 |
3.0 |
| PCIe configurations |
Up to 1x16, 2x8, 1x8+2x4 |
|
| Execute Disable Bit (EDB) |
|
|
| Technologie Intel® Identity Protection |
|
|
| Intel® Memory Protection Extensions (Intel® MPX) |
|
|
| Intel® OS Guard |
|
|
| Technologie Intel® Secure Key |
|
|
| Intel® Software Guard Extensions (Intel® SGX) |
|
|
| Technologie Intel® Trusted Execution (TXT) |
|
|
| Secure Boot |
|
|
| Technologie Enhanced Intel SpeedStep® |
|
|
| Idle States |
|
|
| Extensions de l’ensemble d’instructions |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
|
| Intel 64 |
|
|
| Intel® AES New Instructions |
|
|
| Technologie Intel® Hyper-Threading |
|
|
| Intel® TSX-NI |
|
|
| Technologie Intel® Turbo Boost |
|
|
| Éligibilité à la plateforme Intel® vPro™ |
|
|
| Thermal Monitoring |
|
|
| AMD App Acceleration |
|
|
| AMD Elite Experiences |
|
|
| AMD HD3D technology |
|
|
| AMD Mantle API |
|
|
| Enhanced Virus Protection (EVP) |
|
|
| Frame Rate Target Control (FRTC) |
|
|
| Fused Multiply-Add (FMA) |
|
|
| Fused Multiply-Add 4 (FMA4) |
|
|
| Heterogeneous System Architecture (HSA) |
|
|
| Intel® Advanced Vector Extensions (AVX) |
|
|
| Out-of-band client management |
|
|
| PowerGating |
|
|
| PowerNow |
|
|
| System Image Stability |
|
|
| TrueAudio |
|
|
| VirusProtect |
|
|
| Intel® Virtualization Technology (VT-x) |
|
|
| Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
| Intel® VT-x with Extended Page Tables (EPT) |
|
|
| AMD Virtualization (AMD-V™) |
|
|
| IOMMU 2.0 |
|
|