Nom de code de l’architecture |
Skylake |
|
Date de sortie |
Q4'15 |
Q1 2018 |
Position dans l’évaluation de la performance |
2170 |
2114 |
Processor Number |
i3-6102E |
|
Série |
6th Generation Intel® Core™ i3 Processors |
AMD PRO A-Series A6 APU for Laptops |
Status |
Launched |
|
Segment vertical |
Embedded |
Laptop |
Family |
|
AMD PRO A-Series Processors |
OPN Tray |
|
AM735BAYN23AC |
OS Support |
|
Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit |
Soutien de 64-bit |
|
|
Base frequency |
1.90 GHz |
3 GHz |
Bus Speed |
8 GT/s DMI3 |
|
Processus de fabrication |
14 nm |
28 nm |
Température de noyau maximale |
100°C |
90°C |
Nombre de noyaux |
2 |
2 |
Nombre de fils |
4 |
|
Compute Cores |
|
5 |
Cache L2 |
|
1 MB |
Fréquence maximale |
|
3.6 GHz |
Number of GPU cores |
|
3 |
Ouvert |
|
|
Réseaux de mémoire maximale |
2 |
1 |
Bande passante de mémoire maximale |
34.1 GB/s |
|
Taille de mémore maximale |
64 GB |
|
Genres de mémoire soutenus |
DDR4-2133, LPDDR3-1866, DDR3L-1600 |
|
Supported memory frequency |
|
2133 MHz |
Device ID |
0x191B |
|
Graphics base frequency |
350 MHz |
|
Graphics max dynamic frequency |
950 MHz |
|
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
64 GB |
|
Graphiques du processeur |
Intel® HD Graphics 530 |
AMD Radeon R5 Graphics |
Enduro |
|
|
Freéquency maximale des graphiques |
|
847 MHz |
Graphiques changeables |
|
|
Unified Video Decoder (UVD) |
|
|
Video Codec Engine (VCE) |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
4096x2304@60Hz |
|
Résolution maximale sur eDP |
4096x2304@60Hz |
|
Résolution maximale sur HDMI 1.4 |
4096x2304@24Hz |
|
DirectX |
12 |
12 |
OpenGL |
4.5 |
|
Vulkan |
|
|
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
1 |
|
Package Size |
42mm x 28mm |
|
Prise courants soutenu |
FCBGA1440 |
|
Thermal Design Power (TDP) |
25 Watt |
15 Watt |
Nombre maximale des voies PCIe |
16 |
|
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
Up to 1x16, 2x8, 1x8+2x4 |
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Secure Boot |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
|
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
Adaptive Voltage and Frequency Scaling (AVFS) |
|
|
AMD Secure technology |
|
|
Fused Multiply-Add 4 (FMA4) |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|