Nom de code de l’architecture |
Tiger Lake |
Kaby Lake G |
Date de sortie |
11 Jan 2021 |
10 January 2018 |
Prix de sortie (MSRP) |
$309 |
|
Position dans l’évaluation de la performance |
1065 |
1055 |
Processor Number |
i5-11300H |
i7-8709G |
Série |
11th Generation Intel Core i5 Processors |
8th Generation Intel® Core™ i7 Processors |
Status |
Launched |
Announced |
Segment vertical |
Mobile |
Mobile |
Soutien de 64-bit |
|
|
Cache L1 |
320 KB |
256 KB |
Cache L2 |
5 MB |
1 MB |
Cache L3 |
8 MB |
8 MB |
Processus de fabrication |
10 nm SuperFin |
14 nm |
Température de noyau maximale |
100°C |
100°C |
Fréquence maximale |
4.40 GHz |
4.10 GHz |
Nombre de noyaux |
4 |
4 |
Nombre de fils |
8 |
8 |
Base frequency |
|
3.10 GHz |
Bus Speed |
|
8 GT/s DMI |
Température maximale de la caisse (TCase) |
|
72 °C |
Réseaux de mémoire maximale |
2 |
2 |
Taille de mémore maximale |
64 GB |
64 GB |
Genres de mémoire soutenus |
DDR4-3200, LPDDR4x-4267 |
DDR4-2400 |
Bande passante de mémoire maximale |
|
37.5 GB/s |
Device ID |
0x9A49 |
|
Unités d’éxécution |
80 |
|
Graphics max dynamic frequency |
1.30 GHz |
1.10 GHz |
Technologie Intel® Clear Video HD |
|
|
Intel® Quick Sync Video |
|
|
Graphiques du processeur |
Intel Iris Xe Graphics |
Intel® HD Graphics 630 |
Graphics base frequency |
|
350 MHz |
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Mémoire de vidéo maximale |
|
64 GB |
Nombre d’écrans soutenu |
4 |
3 |
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Résolution maximale sur DisplayPort |
7680x4320@60Hz |
4096 x 2160 @60Hz |
Résolution maximale sur eDP |
4096x2304@60Hz |
4096 x 2160 @60Hz |
Soutien de la resolution 4K |
|
|
Résolution maximale sur HDMI 1.4 |
|
4096 x 2160 @30Hz |
DirectX |
12.1 |
12 |
OpenGL |
4.6 |
4.4 |
Configurable TDP-down |
28 Watt |
|
Configurable TDP-down Frequency |
2.60 GHz |
|
Configurable TDP-up |
35 Watt |
|
Configurable TDP-up Frequency |
3.10 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
46.5x25 |
31mm x 58.5mm |
Prise courants soutenu |
FCBGA1449 |
BGA2270 |
Low Halogen Options Available |
|
|
Thermal Design Power (TDP) |
|
100 Watt |
Intel® OS Guard |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Mode-based Execute Control (MBE) |
|
|
Secure Boot |
|
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Technologie Intel® Secure Key |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® Volume Management Device (VMD) |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Intel 64 |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® My WiFi |
|
|
Technologie Intel® Smart Response |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|
Nombre maximale des voies PCIe |
|
8 |
Révision PCI Express |
|
3.0 |
PCIe configurations |
|
Up to 1x8, 2x4 |