Nom de code de l’architecture |
Comet Lake |
Coffee Lake |
Date de sortie |
16 Mar 2020 |
1 March 2018 |
Prix de sortie (MSRP) |
$583 |
|
Position dans l’évaluation de la performance |
887 |
894 |
Processor Number |
i9-10980HK |
E-2186M |
Série |
10th Generation Intel Core i9 Processors |
Intel® Xeon® E Processor |
Status |
Launched |
Launched |
Segment vertical |
Mobile |
Mobile |
Prix maintenant |
|
$623 |
Valeur pour le prix (0-100) |
|
6.78 |
Soutien de 64-bit |
|
|
Base frequency |
2.40 GHz |
2.90 GHz |
Bus Speed |
8 GT/s |
8 GT/s DMI |
Cache L1 |
512 KB |
384 KB |
Cache L2 |
2 MB |
1.5 MB |
Cache L3 |
12 MB |
12 MB |
Processus de fabrication |
14 nm |
14 nm |
Température de noyau maximale |
100°C |
100°C |
Fréquence maximale |
5.30 GHz |
4.80 GHz |
Nombre de noyaux |
8 |
6 |
Nombre de fils |
16 |
12 |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
45.8 GB/s |
41.8 GB/s |
Taille de mémore maximale |
128 GB |
64 GB |
Genres de mémoire soutenus |
DDR4-2933 |
DDR4-2666, LPDDR3-2133 |
Device ID |
0x9BC4 |
0x3E9B |
Graphics base frequency |
350 MHz |
350 MHz |
Graphics max dynamic frequency |
1.25 GHz |
1.20 GHz |
Intel® Quick Sync Video |
|
|
Graphiques du processeur |
Intel UHD Graphics |
Intel® UHD Graphics P630 |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Mémoire de vidéo maximale |
|
64 GB |
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
4096x2304@60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
4096x2304@60Hz |
4096x2304@60Hz |
Résolution maximale sur HDMI 1.4 |
4096x2304@30Hz |
4096x2304@30Hz |
DirectX |
12 |
12 |
OpenGL |
4.5 |
4.5 |
Configurable TDP-up |
65 Watt |
|
Configurable TDP-up Frequency |
3.10 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
42mm x 28mm |
42mm x 28mm |
Prise courants soutenu |
FCBGA1440 |
FCBGA1440 |
Thermal Design Power (TDP) |
45 Watt |
45 Watt |
Configurable TDP-down |
|
35 W |
Low Halogen Options Available |
|
|
Nombre maximale des voies PCIe |
16 |
16 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
Up to 1x16, 2x8, 1x8+2x4 |
Up to 1x16, 2x8, 1x8+2x4 |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Thermal Velocity Boost |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Technologie Intel® My WiFi |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|